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参数资料
| 型号： | LTM4628EV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 20/36页 |
| 文件大小： | 0K |
| 描述： | IC DC/DC UMODULE 16A 144-LGA |
| 软件下载： | LTM4628 Spice Model |
| 设计资源： | LTM4628 Gerber Files LTM4628EV#PBF Footprint.bxl |
| 特色产品： | μModule Products |
| 标准包装： | 119 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 2 |
| 电压 - 输入（最小）： | 4.5V |
| 电压 - 输入（最大）： | 26.5V |
| Voltage - Output 1： | 5.5V |
| Voltage - Output 2： | 5.5V |
| 电流 - 输出（最大）： | 8A，8A |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 144-BLGA |
| 尺寸/尺寸： | 0.59" L x 0.59" W x 0.17" H（15.0mm x 15.0mm x 4.3mm） |
| 包装： | 管件 |
| 工作温度： | -40°C ~ 125°C |
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LTM4628
APPLICATIONS INFORMATION
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configura-
tion section of the data sheet are consistent with those
parameters defined by JESD 51-12 and are intended for
use with finite element analysis (FEA) software modeling
tools that leverage the outcome of thermal modeling,
simulation, and correlation to hardware evaluation per-
formed on a μModule package mounted to a hardware
test board defined by JESD 51-9 (“Test Boards for Area
Array Surface Mount Package Thermal Measurements”).
The motivation for providing these thermal coefficients is
found in JESD 51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
Many designers may opt to use laboratory equipment
and a test vehicle such as the demo board to anticipate
the μModule regulator’s thermal performance in their ap-
plication at various electrical and environmental operating
conditions to compliment any FEA activities. Without FEA
software, the thermal resistances reported in the Pin Con-
figuration section are in-and-of themselves not relevant
to providing guidance of thermal performance; instead,
the derating curves provided later in this data sheet can
be used in a manner that yields insight and guidance per-
taining to one’s application-usage, and can be adapted to
correlate thermal performance to one’s own application.
The Pin Configuration section gives four thermal coeffi-
cients explicitly defined in JESD 51-12; these coefficients
are quoted or paraphrased below:
1 θ JA , the thermal resistance from junction to ambient, is
the natural convection junction-to-ambient air thermal
resistance measured in a one cubic foot sealed enclo-
sure. This environment is sometimes referred to as “still
air” although natural convection causes the air to move.
This value is determined with the part mounted to a
JESD 51-9 defined test board, which does not reflect
an actual application or viable operating condition.
2 θ JCbottom , the thermal resistance from junction to the
bottom of the product case, is determined with all of
the component power dissipation flowing through the
bottom of the package. In the typical μModule regulator,
the bulk of the heat flows out the bottom of the pack-
age, but there is always heat flow out into the ambient
environment. As a result, this thermal resistance value
may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
3 θ JCtop , the thermal resistance from junction to top of
the product case, is determined with nearly all of the
component power dissipation flowing through the top of
the package. As the electrical connections of the typical
μModule regulator are on the bottom of the package, it
is rare for an application to operate such that most of
the heat flows from the junction to the top of the part.
As in the case of θ JCbottom , this value may be useful
for comparing packages but the test conditions don’t
generally match the user’s application.
4 θ JB , the thermal resistance from junction to the printed
circuit board, is the junction-to-board thermal resis-
tance where almost all of the heat flows through the
bottom of the μModule regulator and into the board,
and is really the sum of the θ JCbottom and the thermal
resistance of the bottom of the part through the solder
joints and through a portion of the board. The board
temperature is measured a specified distance from the
package, using a two sided, two layer board. This board
is described in JESD 51-9.
A graphical representation of the aforementioned thermal
resistances is given in Figure 10; blue resistances are
contained within the μModule regulator, whereas green
resistances are external to the μModule package.
4628fe
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For more information www.linear.com/LTM4628
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相关代理商/技术参数 |
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| LTM4628IV#PBF | 功能描述:IC DC/DC UMODULE 16A 144-LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:21V 电压 - 输入（最大）:32V Voltage - Output 1:5V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:100W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-SlimMod 尺寸/尺寸:4.60" L x 1.80" W x 0.52" H（116.8mm x 45.7mm x 13.2mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM4628IVPBF | 制造商:LINEAR_DIMENSIONS 制造商全称:LINEAR_DIMENSIONS 功能描述:Dual 8A or Single 16A DC/DC ??Module Regulator |
| LTM4628IY#PBF | 制造商:Linear Technology 功能描述:IC DC/DC UMODULE 16A 144-BGA 制造商:Linear Technology 功能描述:DP-uModule, Dual 8A or Single 16A DC/DC uModule Regulator |
| LTM4630EV#PBF | 制造商:Linear Technology 功能描述:DC/DC CONVERTER DUAL 0.6-1.8 65W 制造商:Linear Technology 功能描述:BUCK UMODULE 15VIN 18A LGA 制造商:Linear Technology 功能描述:DC-DC REGULATOR, BUCK, ADJ, LGA-144, Primary Input Voltage:15V, No. of Outputs:2 制造商:Linear Technology 功能描述:DC-DC REGULATOR, BUCK, ADJ, LGA-144, Primary Input Voltage:15V, No. of Outputs:2, Output Current:36A, No. of Pins:144, Operating Temperature Min:-40C, Operating Temperature Max:125C, MSL:MSL 3 - 168 hours, Package / Case:144-LGA , RoHS Compliant: Yes |
| LTM4630IV#PBF | 制造商:Linear Technology 功能描述:DC/DC CONVERTER DUAL 0.6-1.8 65W 制造商:Linear Technology 功能描述:BUCK UMODULE 15VIN 18A LGA 制造商:Linear Technology 功能描述:DC-DC REGULATOR, BUCK, ADJ, LGA-144, Primary Input Voltage:15V, No. of Outputs:2, Output Current:36A, No. of Pins:144, Operating Temperature Min:-40C, Operating Temperature Max:125C, MSL:MSL 3 - 168 hours, Package / Case:144-LGA , RoHS Compliant: Yes |
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