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| 型号： | LTM8027IV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/22页 |
| 文件大小： | 0K |
| 描述： | IC BUCK SYNC ADJ 4A 113LGA |
| 产品培训模块： | LTM8027 - 60V, 4A DC/DC µModule Regulator Power Module vs. Discrete DC to DC |
| 软件下载： | LTM8027 Spice Model |
| 产品目录绘图： | LTM Series_15x15x4.3 |
| 设计资源： | DC1307A Design Files LTM8027IV#PBF Footprint.bxl |
| 特色产品： | μModule Products |
| 标准包装： | 119 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 4.5V |
| 电压 - 输入（最大）： | 60V |
| Voltage - Output 1： | 2.5 ~ 24 V |
| 电流 - 输出（最大）： | 4A |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 113-LGA |
| 尺寸/尺寸： | 0.59" L x 0.59" W x 0.17" H（15.0mm x 15.0mm x 4.3mm） |
| 包装： | 托盘 |
| 工作温度： | -40°C ~ 125°C |
| 效率： | 95% |
| 产品目录页面： | 2711 (CN2011-ZH PDF) |
| 配用： | DC1307A-ND - BOARD EVAL LTM8027 |
LTM8027
APPLICATIONS INFORMATION
V OUT
C OUT
C OUT
GND
AUX
BIAS1
SS
RUN
BIAS2
C IN
V IN
R ADJ
GND
R T
SYNC
Figure 3. Suggested Layout
8027 F03
Ensure that the grounding and heat sinking are acceptable.
A few rules to keep in mind are:
1. Place the R ADJ and R T resistors as close as possible to
their respective pins.
2. Place the C IN capacitor as close as possible to the V IN
and GND connection of the LTM8027.
3. Place the C OUT capacitor as close as possible to the
V OUT and GND connection of the LTM8027.
4. Place the C IN and C OUT capacitors such that their
ground current flow directly adjacent to or underneath
the LTM8027.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8027.
Use vias to connect the GND copper area to the board’s
internal ground planes. Liberally distribute these GND vias
to provide both a good ground connection and thermal
path to the internal planes of the printed circuit board. Pay
attention to the location and density of the thermal vias in
Figure 3. The LTM8027 can benefit from the heat sinking
afforded by vias that connect to internal GND planes at
these locations, due to their proximity to internal power
handling components. The optimum number of thermal
vias depends upon the printed circuit board design. For
example, a board might use very small via holes. It should
employ more thermal vias than a board that uses larger
holes.
Thermal Considerations
The LTM8027 output current may need to be derated if it
is required to operate in a high ambient temperature or
deliver a large amount of continuous power. The amount
of current derating is dependent upon the input voltage,
output power and ambient temperature. The temperature
rise curves given in the Typical Performance Character-
istics section can be used as a guide. These curves were
generated by a LTM8027 mounted to a 58cm 2 4-layer FR4
printed circuit board. Boards of other sizes and layer count
can exhibit different thermal behavior, so it is incumbent
upon the user to verify proper operation over the intended
system’s line, load and environmental operating conditions.
8027fb
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM8027MPV | 制造商:LINER 制造商全称:Linear Technology 功能描述:60V, 4A DC/DC Module Regulator |
| LTM8027MPV#PBF | 功能描述:IC BUCK SYNC ADJ 4A 113LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:Maxi/Mini/Micro Design Guide, Appl Manual 标准包装:1 系列:微型 类型:隔离 输出数:1 电压 - 输入（最小）:18V 电压 - 输入（最大）:36V Voltage - Output 1:48V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:100W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:模块 尺寸/尺寸:2.28" L x 1.45" W x 0.62" H（57.9mm x 36.8mm x 15.7mm） 包装:散装 工作温度:-20°C ~ 100°C 效率:* 电源（瓦特）- 最大:* 其它名称:1102-1290V24C48C100BL-ND |
| LTM8027MPV#PBF | 制造商:Linear Technology 功能描述:DC/DC Converter IC |
| LTM8027MPVPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:60V, 4A DC/DC Module Regulator |
| LTM8027V | 制造商:LINER 制造商全称:Linear Technology 功能描述:Complete Switch Mode Power Supply |
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