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参数资料
| 型号： | LTM8033EV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 18/26页 |
| 文件大小： | 0K |
| 描述： | IC DC-DC UMODULE BUCK 3A 76-LGA |
| 产品培训模块： | Power Module vs. Discrete DC to DC µModule® Family of EN55022 Class B Certified Regulators |
| 软件下载： | LTM8033 Spice Model |
| 产品目录绘图： | LTM8033 |
| 设计资源： | DC1623A Design Files LTM8033EV#PBF Footprint.bxl |
| 特色产品： | μModule Products |
| 标准包装： | 119 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 3.6V |
| 电压 - 输入（最大）： | 36V |
| Voltage - Output 1： | 0.8 ~ 24 V |
| 电流 - 输出（最大）： | 3A |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 76-LGA |
| 尺寸/尺寸： | 0.59" L x 0.44" W x 0.17" H（15.0mm x 11.3mm x 4.3mm） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 125°C |
| 产品目录页面： | 2711 (CN2011-ZH PDF) |
LTM8033
APPLICATIONS INFORMATION
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confu-
sion and inconsistency. These definitions are given in
JESD 51-12, and are quoted or paraphrased in the fol-
lowing:
? θ JA is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to as
“still air” although natural convection causes the air to
move. This value is determined with the part mounted to
a JESD 51-9 defined test board, which does not reflect
an actual application or viable operating condition.
? θ JCBOTTOM is the junction-to-board thermal resistance
with all of the component power dissipation flowing
through the bottom of the package. In the typical
μModule, the bulk of the heat flows out the bottom of
the package, but there is always heat flow out into the
ambient environment. As a result, this thermal resistance
value may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
? θ JCTOP is determined with nearly all of the component
power dissipation flowing through the top of the pack-
age. As the electrical connections of the typical μModule
are on the bottom of the package, it is rare for an ap-
plication to operate such that most of the heat flows
from the junction to the top of the part. As in the case
of θ JCBOTTOM , this value may be useful for comparing
packages but the test conditions don’t generally match
the user’s application.
almost all of the heat flows through the bottom of the
μModule and into the board, and is really the sum of
the θ JCBOTTOM and the thermal resistance of the bottom
of the part through the solder joints and through a por-
tion of the board. The board temperature is measured a
specified distance from the package, using a two sided,
two layer board. This board is described in JESD 51-9.
The most appropriate way to use the coefficients is when
running a detailed thermal analysis, such as FEA, which
considers all of the thermal resistances simultaneously.
None of them can be individually used to accurately pre-
dict the thermal performance of the product, so it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature versus load graphs
given in the LTM8033 data sheet.
A graphical representation of these thermal resistances
is given in Figure 5.
The blue resistances are contained within the μModule,
and the green are outside.
The die temperature of the LTM8033 must be lower than
the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking
of the LTM8033. The bulk of the heat flow out of the
LTM8033 is through the bottom of the module and the LGA
pads into the printed circuit board. Consequently a poor
printed circuit board design can cause excessive heating,
resulting in impaired performance or reliability. Please
refer to the PCB Layout section for printed circuit board
? θ JB is the junction-to-board thermal resistance where
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
At
μMODULE REGULATOR
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
8033 F05
Figure 5
8033fa
18
For more information www.linear.com/LTM8033
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相关代理商/技术参数 |
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| LTM8033IV#PBF | 功能描述:IC DC-DC UMODULE BUCK 3A 76-LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:66V 电压 - 输入（最大）:160V Voltage - Output 1:12V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:50W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-FinMod 尺寸/尺寸:4.60" L x 1.86" W x 0.79" H（116.8mm x 47.2mm x 20.1mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM8033IV-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Ultralow Noise EMC 36VIN, 3A DC/DC μModule Regulator |
| LTM8033MPV#PBF | 功能描述:IC DC-DC UMODULE BUCK 3A 76-LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:66V 电压 - 输入（最大）:160V Voltage - Output 1:12V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:50W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-FinMod 尺寸/尺寸:4.60" L x 1.86" W x 0.79" H（116.8mm x 47.2mm x 20.1mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM8033MPV-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Ultralow Noise EMC 36VIN, 3A DC/DC ??Module Regulator |
| LTM8040 | 制造商:LINER 制造商全称:Linear Technology 功能描述:36V, 1A μModule LED Driver |
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