参数资料
型号: LTM8048MPY#PBF
厂商: Linear Technology
文件页数: 15/20页
文件大小: 0K
描述: IC DC/DC UMODULE LDO BGA
产品培训模块: LTM8047 and LTM8048 1.5W, 725 VDC Isolated Micromodule Converter
标准包装: 168
系列: µModule®
类型: 隔离
输出数: 2
电压 - 输入(最小): 3.1V
电压 - 输入(最大): 32V
Voltage - Output 1: 2.5 ~ 13 V
Voltage - Output 2: 1.2 ~ 12 V
电流 - 输出(最大): 440mA,300mA
电压 - 隔离: 725V
特点: 带有 UVLO
安装类型: 表面贴装
封装/外壳: 45-BGA
尺寸/尺寸: 0.44" L x 0.35" W x 0.19" H(11.3mm x 9.0mm x 4.9mm)
包装: 托盘
工作温度: -55°C ~ 125°C
LTM8048
APPLICATIONS INFORMATION
A graphical representation of these thermal resistances
is given in Figure 2.
The blue resistances are contained within the μModule
converter, and the green are outside.
The die temperature of the LTM8048 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8048. The bulk of the heat flow out of the LTM8048
is through the bottom of the module and the BGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
AMBIENT
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
8048 F02
μMODULE DEVICE
Figure 2.
8048ff
For more information www.linear.com/LTM8048
15
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