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参数资料
| 型号： | LTM8052AIV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 22/30页 |
| 文件大小： | 0K |
| 描述： | IC UMODULE 36VIN 5A CVCC 81LGA |
| 产品培训模块： | LTM8026 and LTM8052 Step-Down uModule Regulators |
| 标准包装： | 119 |
| 系列： | * |
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LTM8052/LTM8052A
APPLICATIONS INFORMATION
θ JB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
μModule regulator and into the board, and is really the
sum of the θ JCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a 2-sided,
2-layer board. This board is described in JESD 51-9.
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
operating condition of a μModule regulator. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 7.
The blue resistances are contained within the μModule
device, and the green are outside.
The die temperature of the LTM8052/LTM8052A must be
lower than the maximum rating of 125°C, so care should
be taken in the layout of the circuit to ensure good heat
sinking of the LTM8052/LTM8052A. The bulk of the
heat flow out of the LTM8052/LTM8052A is through the
bottom of the module and the LGA pads into the printed
circuit board. Consequently a poor printed circuit board
design can cause excessive heating, resulting in impaired
performance or reliability. Please refer to the PCB Layout
section for printed circuit board design suggestions.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
AMBIENT
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
8052 F07
μMODULE DEVICE
Figure 7. Thermal Resistances Among μModule Device,
Printed Circuit Board and Environment
22
For more information www.linear.com/LTM8052
8052fc
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| LTM8052IV#PBF | 功能描述:IC UMODULE CVCC STEP DOWN 81LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:55V 电压 - 输入（最大）:100V Voltage - Output 1:5.8V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:100W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9 针半砖 BusMod 尺寸/尺寸:2.36" L x 2.28" W x 1.08" H（59.9mm x 57.9mm x 27.4mm） 包装:散装 工作温度:-25°C ~ 100°C 效率:* 电源（瓦特）- 最大:* |
| LTM8061 | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
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