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参数资料
| 型号： | LTM8052IV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 22/30页 |
| 文件大小： | 0K |
| 描述： | IC UMODULE CVCC STEP DOWN 81LGA |
| 产品培训模块： | LTM8026 and LTM8052 Step-Down uModule Regulators |
| 标准包装： | 119 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 6V |
| 电压 - 输入（最大）： | 36V |
| Voltage - Output 1： | 1.2 ~ 24 V |
| 电流 - 输出（最大）： | 5A |
| 特点： | 带有 UVLO |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 81-BLGA |
| 尺寸/尺寸： | 0.59" L x 0.44" W x 0.11" H（15.0mm x 11.3mm x 2.8mm） |
| 包装： | 托盘 |
| 工作温度： | -40°C ~ 125°C |
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LTM8052/LTM8052A
APPLICATIONS INFORMATION
θ JB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
μModule regulator and into the board, and is really the
sum of the θ JCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a 2-sided,
2-layer board. This board is described in JESD 51-9.
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
operating condition of a μModule regulator. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 7.
The blue resistances are contained within the μModule
device, and the green are outside.
The die temperature of the LTM8052/LTM8052A must be
lower than the maximum rating of 125°C, so care should
be taken in the layout of the circuit to ensure good heat
sinking of the LTM8052/LTM8052A. The bulk of the
heat flow out of the LTM8052/LTM8052A is through the
bottom of the module and the LGA pads into the printed
circuit board. Consequently a poor printed circuit board
design can cause excessive heating, resulting in impaired
performance or reliability. Please refer to the PCB Layout
section for printed circuit board design suggestions.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
AMBIENT
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
8052 F07
μMODULE DEVICE
Figure 7. Thermal Resistances Among μModule Device,
Printed Circuit Board and Environment
22
For more information www.linear.com/LTM8052
8052fc
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM8061 | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
| LTM8061EV-4.1#PBF | 功能描述:IC BATTERY CHARGER 4.1V 77-LGA RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:µModule® 其它有关文件:STC3100 View All Specifications 特色产品:STC3100 - Battery Monitor IC 标准包装:4,000 系列:- 功能:燃料，电量检测计/监控器 电池化学:锂离子（Li-Ion） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MiniSO 包装:带卷 (TR) 其它名称:497-10526-2 |
| LTM8061EV-4.1PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
| LTM8061EV-4.2#PBF | 功能描述:IC BATTERY CHARGER 4.2V 77-LGA RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:µModule® 其它有关文件:STC3100 View All Specifications 特色产品:STC3100 - Battery Monitor IC 标准包装:4,000 系列:- 功能:燃料，电量检测计/监控器 电池化学:锂离子（Li-Ion） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MiniSO 包装:带卷 (TR) 其它名称:497-10526-2 |
| LTM8061EV-4.2PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
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