参数资料
| 型号： | LV47011P-E |
| 厂商： | ON Semiconductor |
| 文件页数： | 10/10页 |
| 文件大小： | 0K |
| 描述： | IC AUDIO AMP BTL 50W 4CH HZIP25 |
| 标准包装： | 15 |
| 类型： | AB 类 |
| 输出类型： | 4-通道（四路） |
| 在某负载时最大输出功率 x 通道数量： | 29W x 4 @ 4 欧姆 |
| 电源电压： | 8 V ~ 16 V |
| 特点： | 静音，短路和热保护 |
| 安装类型： | * |
| 供应商设备封装： | * |
| 封装/外壳： | * |
| 包装： | * |
LV47011P
No.A1838-9/10
HZIP25 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a.
Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
Use flat-head screws to attach heat sinks.
Use also washer to protect the package.
Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
Take care a position of via hole .
Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
Verify that there are no press burrs or screw-hole burrs on the heat sink.
Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
Twisting must be limited to under 0.05 mm.
Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
c.
Silicone grease
Spread the silicone grease evenly when mounting heat sinks.
Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
Take care not to allow the device to ride onto the jig or positioning dowel.
Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LV47011PGEVB | 制造商:ON Semiconductor 功能描述:EVABOARD FOR LV47011P - Boxed Product (Development Kits) |
| LV47017P | 制造商:SANYO 制造商全称:Sanyo Semicon Device 功能描述:For Car Audio Systems 4-Channel BTL Power Amplifier |
| LV47017P_12 | 制造商:SANYO 制造商全称:Sanyo Semicon Device 功能描述:4-Channel BTL Power Amplifier |
| LV47017P-E | 功能描述:音频放大器 CAR AUDIO POWER SUPPLY RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| LV47022P | 制造商:SANYO 制造商全称:Sanyo Semicon Device 功能描述:Monolithic Linear IC For Car Audio Systems 4-Channel BTL Power Amplifier |
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