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参数资料
| 型号： | LX1673-09CPWTR |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | 1 A SWITCHING CONTROLLER, 1035 kHz SWITCHING FREQ-MAX, PDSO20 |
| 封装： | PLASTIC, TSSOP-20 |
| 文件页数： | 6/13页 |
| 文件大小： | 259K |
| 代理商： | LX1673-09CPWTR |
Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev 0.4a, 5/25/2004
WWW
.Microse
m
i
.CO
M
LX1673
High Frequency PWM Regulator
PRELIMINARY DATA SHEET
TM
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient .........................................................-0.3V to 6V
Driver Supply Voltage (VCCL) DC .....................................................-0.3V to 13V
Driver Supply Voltage (VCCL) Transient............................................-0.3V to 16V
Driver Supply Voltage (VC1) DC .......................................................-0.3V to 19V
Input Voltage (SS/DIS) .....................................................................-0.3V to 5.5V
Output Drive Peak Current Source (HO, LO).......................................1A (500ns)
Output Drive Peak Current Sink (HO, LO) ..........................................1A (500ns)
Operating Temperature Range .........................................................-40
°C to 85°C
Maximum Operating Junction Temperature ................................................ 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
Lead Temperature (Soldering 180 seconds) ................................................ 235
°C
Package Peak Temp. for Solder Reflow (40 Seconds Maximum Exposure).. 255°C(+5, -0)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
The limitation on transient time is thermal and is due to zener diodes on the supply
pins, application of maximum voltages will increase current into that pin and
increase package power dissipation.
TH ERMAL DATA
PW
Plastic TSSOP 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
90
°C/W
LQ
Plastic MLPQ 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The
θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no airflow.
PACKAGE PIN OUT
LDGD
LDFB
LDDIS
DGND
AGND
CS
VS
VCC
VCCL
BDRV
PG
N
D
TD
R
V
VC
1
PW
G
D
LD
V
C
EAO
EA-
EA+
SS
DIS
1
6
11
16
LQ PACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
VC1
PGOOD
LDOVCC
LDGD
LDFB
LDDIS
DGND
AGND
EAO
CS
VS
VCC
VCCL
BDRV
PGND
TDRV
1
10
11
20
DIS
SS
EA+
EA-
PW PACKAGE
(Top View)
Pb-free 100% Matte Tin Lead Finish
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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