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参数资料
| 型号： | LX1677CPW |
| 英文描述： | PWM Controllers |
| 中文描述： | PWM控制器 |
| 文件页数： | 2/21页 |
| 文件大小： | 554K |
| 代理商： | LX1677CPW |
Microsemi
Integrated Products, Power Management
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 0.5i, 2002-07-17
W
M
.
C
LX1671
Multiple Output LoadSHARE PWM
P
RELIMINARY
I N T E G R A T E D P R O D U C T S
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V
CC
) DC................................................................-0.3V to 5.5V
Supply Voltage (V
CC
) Transient......................................................-0.3V to 6.0V
Driver Supply Voltage (V
C
x
, V
CCL
) DC............................................-0.3V to 16V
Driver Supply Voltage (V
C
x
, V
CCL
) Transient...................................-0.3V to 18V
Current Sense Inputs (V
SX
, CSX)..................................................... -0.3V to 12V
Error Amplifier Inputs (FB
X
, RF
2
) ...................................................-0.3V to 5.5V
Input Voltage (SS/
SHDN
)..................................................................-0.3V to5.5V
Output Drive Peak Current Source (HO
x
, LO
x
)...................................1A (500ns)
Output Drive Peak Current Sink (HO
x
, LO
x
).......................................1A (500ns)
Operating Junction Temperature..................................................................150
°
C
Storage Temperature Range .......................................................... -65
°
C to 150
°
C
Lead Temperature (Soldering 180 seconds).................................................235
°
C
Note:
Exceeding these ratings could cause damage to the device. All voltages are
with respect to Ground. Currents are positive into, negative out of specified
terminal.
The limitation on transient time is thermal and is due to zener diodes on the
supply pins, application of maximum voltages will increase current into that
pin and increase package power dissipation..
x
= Denotes Phase 1, 2, or 3
THERMAL DATA
PW
Plastic TSSOP 38-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
85
°
C/W
LQ
Plastic MLP 38-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JC
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
35
°
C/W
PACKAGE PIN OUT
1
19
38
20
LO1
PG1
LO2
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
CS2
VS2
SS1
FB1
EO1
CS1
VS1
SS3
FB3
EO3
CS3
N.C.
VS3
VCC
N/U
VCCL
PG3
LO3
HO3
VC3
VC1
H01
N.C.
PW P
ACKAGE
(Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
SS3
FB3
EO3
N.C.
CS3
VS3
N.C.
N.C.
VCC
VCCL
PG3
H
V
V
H
L
P
L
C
V
S
F
E
C
V
LO3
Connect Bottom to
Power GND
LQ P
ACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
P
A
C
K
A
G
E
D
A
T
A
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