参数资料
型号: LX1701ILQ
厂商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分类: 音频/视频放大
英文描述: 3.9 W, 1 CHANNEL, AUDIO AMPLIFIER, PQCC16
封装: 4 X 4 MM, PLASTIC, MLPQ-16
文件页数: 9/20页
文件大小: 478K
代理商: LX1701ILQ
LX1701
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 17
WWW
.Microse
m
i
.CO
M
2W Filterless Mono Class-D Audio Amplifier
Copyright
2004
Rev. 1.0, 2004-06-09
TM
PCB DESIGN GU IDELINES (CONTINUED )
THERMAL PAD VIA DESIGN
There are two types of on-board thermal PAD design, one
is using thermal vias to sink the heat to the other layer with
metal traces. Based on Jedec Specification JESD 51-5, the
thermal vias should be designed like Figure 7. Another one
is the no via thermal PAD which is using the same side
copper PAD as heatsink, this type of thermal PAD is good
for two layer board, since the bottom side is filled with all
other kinds of trace also, it’s hard to use the whole plane for
the heatsink. But you still can use vias to sink the heat to
the bottom layer by the metal traces, then layout a NMSD
on which a metal heatsink is put to sink the heat to the
air.
Micro Lead Quad
Package Land Pattern
Land Pattern for Four
Layer Board with Vias
Figure 7 –
Comparison of land pattern theory
For LX1701 with MLPQ-4x4 16Lds p ackage, which has
θjA =38.1°C/W by package itself, with maximum 2W
(@4ohm) output it only has 300mW power dispassion
(assuming 85% efficiency), which only has 11.4
°C
temperature rise. So the non-via type thermal PAD is
suggested.
0.3mm Dia.
0.15mm
minimum gap
2.50mm
Maximum
0.28mm
0.37mm Nominal
0.05mm minimum
0.5mm
0.15mm minimum
Package Pad
PCB Land
Thermal Via
Pin 1 Indicator
(bottom of Package)
1 - 1.2mm
Top View
Figure 8 –
Recommended Land Pad with Vias for LQ16
AA
PP
LL
IICC
AA
TT
IIOO
NN
SS
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