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参数资料
| 型号： | LX2173CP |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | 2.8 A SWITCHING REGULATOR, 115 kHz SWITCHING FREQ-MAX, PSFM5 |
| 封装： | PLASTIC, TO-220, 5 PIN |
| 文件页数： | 2/6页 |
| 文件大小： | 254K |
| 代理商： | LX2173CP |
1.25A HIGH-EFFICIENCY 100KHZ SWITCHING REGULATOR
LX2172/73
PRODUCT DA T ABOOK 1996/1997
Copyright 1998
Rev. 0.4
a 12/04
2
P RELIMINAR Y D AT A S HEET
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (V
IN) .................................................................................................... 25V
Collector Supply Voltage (V
C) ..................................................................................... 65V
Digital Inputs (SYNC) ......................................................................................... -0.3 to 7V
Operating Junction Temperature ................................................................. 0°C to 125°C
Storage Temperature Range .................................................................... -65°C to +150°C
Solder Temperature (Soldering, 10 seconds) .......................................................... 300°C
PACKAGE PIN OUTS
E
2
V
SW
E
1
V
IN
GND
V
C
FB
* SYNC / ENABLE
1
8
27
36
45
M PACKAGE
(Top View)
DM PACKAGE
(Top View)
E
2
V
SW
E
1
V
IN
GND
V
C
FB
* SYNC / ENABLE
1
8
27
36
45
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal.
THERMAL DATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
95°C/W
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
P PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB,
θθθθθ
JT
4.5°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
60°C/W
Junction Temperature Calculation:
T
J = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
V
IN
V
SW
GND
FB
V
C
P PACKAGE
(Top View)
1
5
TAB IS GND
* Pin 4 = SYNC for LX2172, ENABLE for LX2173/2174
5
1
3
2
7
6
8
V IN
GN D
EN ABL E
F B
V C
SYN C
E1
E2
S W
100 k H z
OS C
IN
250m V
1. 4V
C. S .
AM P
0.
16W
0.
16W
Q1
Q2
R
S
Q
PW M
CO M P
PW M
LA T C H
0. 15V
S. D .
CO M P
E. A.
1. 27V
g M
1. 4V
EN ABL E
CO M P
EN
2. 3V
V RE G
UV L O CO M P
EN
V IN
V O
(N O T E 1 )
V OF S
(0 . 9 V )
V O
2. 3V
V RE G
SL O PE C O M P
100k H z
Note 1: LX2172 Only: SYNC brought out to pin 4. ENABLE is tied to V
IN.
LX2173 Only: ENABLE brought out to pin 4. SYNC is open.
BLOCK DIAGRAM
Pb-free / RoHS Peak Package Solder Reflow Temp (40 second max. exposure)................. 260°C (+0, -5)
RoHS / Pb-free 100% Matte Tin Lead Finish
O
B
SO
LETE
PRO
D
UCT
NOT
RECOMMENDED
FOR
NEW
DESIGNS
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