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参数资料
| 型号： | LX256EV-35FN484C |
| 厂商： | Lattice Semiconductor Corporation |
| 文件页数： | 4/9页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH DIGITAL 484FPBGA |
| 标准包装： | 60 |
| 功能： | 开关 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 484-BBGA |
| 供应商设备封装： | 484-FPBGA（23x23） |
| 包装： | 托盘 |
www.latticesemi.com
1
gdx2fam_13
ispGDX2 Family
High Performance Interfacing and Switching
September 2005
Data Sheet
2005 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specications and information herein are subject to change without notice.
Includes
High-
Performanc
e,
Low-Cost
“E-Series”
Features
■ High Performance Bus Switching
High bandwidth
– Up to 12.8 Gbps (SERDES)
– Up to 38 Gbps (without SERDES)
Up to 16 (15x10) FIFOs for data buffering
High speed performance
–fMAX = 360MHz
–tPD = 3.0ns
–tCO = 2.9ns
–tS = 2.0ns
Built-in programmable control logic capability
I/O intensive: 64 to 256 I/Os
Expanded MUX capability up to 188:1 MUX
■ sysCLOCK PLL
Frequency synthesis and skew management
Clock multiply and divide capability
Clock shifting up to +/-2.35ns in 335ps steps
Up to four PLLs
■ sysIO Interfacing
LVCMOS 1.8, 2.5, 3.3 and LVTTL support for
standard board interfaces
SSTL 2/3 Class I and II support
HSTL Class I, III and IV support
GTL+, PCI-X for bus interfaces
LVPECL, LVDS and Bus LVDS differential support
Hot socketing
Programmable drive strength
■ Two Options Available
High-performance sysHSI (standard part number)
Low-cost, no sysHSI (“E-Series”)
■ sysHSI Blocks Provide up to 16 High-speed
Channels
Serializer/de-serializer (SERDES) included
Clock Data Recovery (CDR) built in
800 Mbps per channel
LVDS differential support
10B/12B support
– Encoding / decoding
– Bit alignment
– Symbol alignment
8B/10B support
– Bit alignment
– Symbol alignment
Source Synchronous support
■ Flexible Programming and Testing
IEEE 1532 compliant In-System Programmabil-
ity (ISP)
Boundary scan test through IEEE 1149.1
interface
3.3V, 2.5V or 1.8V power supplies
5V tolerant I/O for LVCMOS 3.3 and LVTTL
interfaces
Table 1. ispGDX2 Family Selection Guide
ispGDX2-64/E
ispGDX2-128/E
ispGDX2-256/E
I/Os
64
128
256
GDX Blocks
4
8
16
tPD
3.0ns
3.2ns
3.5ns
tS
2.0ns
tCO
2.9ns
3.1ns
3.2ns
fMAX (Toggle)
360MHz
330MHz
300MHz
Max Bandwidth
SERDES
1, 2
3.2Gbps
6.4Gbps
12.8Gbps
Without SERDES
3
11Gbps
21Gbps
38Gbps
sysHSI Channels
2
48
16
LVDS/Bus LVDS (Pairs)
32
64
128
PLLs
2
4
Package
100-ball fpBGA
208-ball fpBGA
484-ball fpBGA
1. Max number of SERDES channels per device * 800Mbps
2. “E-Series” does not support sysHSI.
3. fMAX (Toggle) * maximum I/Os divided by 2.
SELECT
DEVICES
DISCONTINUED
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LX256EV-5F484C | 功能描述:模拟和数字交叉点 IC 256 I/O SW Matrix 3.3V, 5ns, E-series RoHS:否 制造商:Micrel 配置:2 x 2 封装 / 箱体:MLF-16 数据速率:10.7 Gbps 输入电平:CML, LVDS, LVPECL 输出电平:CML 电源电压-最大:3.6 V 电源电压-最小:2.375 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 产品:Digital Crosspoint 封装:Tube |
| LX256EV-5F484I | 功能描述:模拟和数字交叉点 IC 256 I/O SW Matrix 3.3V, 5ns, E-series RoHS:否 制造商:Micrel 配置:2 x 2 封装 / 箱体:MLF-16 数据速率:10.7 Gbps 输入电平:CML, LVDS, LVPECL 输出电平:CML 电源电压-最大:3.6 V 电源电压-最小:2.375 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 产品:Digital Crosspoint 封装:Tube |
| LX256EV-5FN484C | 功能描述:模拟和数字交叉点 IC 256 I/O SW Matrix 3.3V, 5ns, E-series RoHS:否 制造商:Micrel 配置:2 x 2 封装 / 箱体:MLF-16 数据速率:10.7 Gbps 输入电平:CML, LVDS, LVPECL 输出电平:CML 电源电压-最大:3.6 V 电源电压-最小:2.375 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 产品:Digital Crosspoint 封装:Tube |
| LX256EV-5FN484I | 功能描述:模拟和数字交叉点 IC 256 I/O SW Matrix 3.3V, 5ns, E-series RoHS:否 制造商:Micrel 配置:2 x 2 封装 / 箱体:MLF-16 数据速率:10.7 Gbps 输入电平:CML, LVDS, LVPECL 输出电平:CML 电源电压-最大:3.6 V 电源电压-最小:2.375 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 产品:Digital Crosspoint 封装:Tube |
| LX256EVCF1003 | 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:High Performance Interfacing and Switching |
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