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参数资料
| 型号： | LX7001ILP-TR |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 电源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBCY3 |
| 封装： | ROHS COMPLIANT, PLASTIC, TO-92, 3 PIN |
| 文件页数： | 2/9页 |
| 文件大小： | 166K |
| 代理商： | LX7001ILP-TR |
TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
LX7001
PRODUCT DA T ABOOK 1996/1997
Copyright 1999
Rev. 1.2a 10/04
2
P RODUCTION
D AT A
S HEET
ABSOLUTE MAXIMUM RA TINGS
(Note 1)
Input Supply Voltage (V
IN) ............................................................................... -1V to 12V
RESET Output Voltage (V
OUT) .......................................................................... -1V to 12V
Output Sink Current (I
OL) ............................................................ Internally Limited (mA)
Clamp Diode Forward Current (I
F), Pin 1 to pin 2 ............................................... 100mA
Operating Junction Temperature
Ceramic (Y - Package) .......................................................................................... 150°C
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
PACKAGE PIN OUTS
RESET
V
IN
N.C.
GROUND
N.C.
1
8
2
7
3
6
4
5
DM PACKAGE
(Top View)
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
.....
JA
165°C/W
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
.....
JA
156°C/W
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
.....
JA
130°C/W
Junction Temperature Calculation:
T
J = TA + (PD x . JA).
The
.
JA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
THERMAL DATA
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
3. GROUND
2. V
IN
1. RESET
LP PACKAGE
(Top View)
Y PACKAGE
(Top View)
RESET
V
IN
N.C.
GROUND
N.C.
18
27
36
45
Peak Package Solder Reflow Temp. (40 second max. exposure)...
................................260°C(+0, -5)
RoHS / Pb-free 100% Matte Tin Lead Finish
O
B
SO
LETE
PRO
D
UCT
NOT
RECOMMENDED
FOR
NEW
DESIGNS
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