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参数资料
| 型号： | LX8819-25CDT |
| 厂商： | MICROSEMI CORP |
| 元件分类： | Fixed/Adjustable Positive Multiple Output LDO Regulator |
| 英文描述： | DUAL OUTPUT, FIXED/ADJUSTABLE POSITIVE LDO REGULATOR, PSSO5 |
| 封装： | PLASTIC, TO-252, D-PAK, 5-PIN |
| 文件页数： | 6/9页 |
| 文件大小： | 305K |
| 代理商： | LX8819-25CDT |
LX8819
DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
WWW
.Microse
m
i
.CO
M
Dual Channel 1A Low Dropout Regulator
Copyright
2003
Revision 1.0a, 4/29/2005
TM
APPLI CATI ON I N FORMATI O N
Using the calculated total power dissipation, the
maximum junction temperature can be calculated using the
given temperature coefficients (See Thermal Data) for the
selected package.
THERMAL CALCULATION EXAMPLE
Given the following application parameters:
mA
500
I
V
5
.
2
V
5
.
1
V
%
5
V
5
V
C
50
T
)
MAX
(
2
OUT
)
MAX
(
1
OUT
2
OUT
1
OUT
)
MAX
(
IN
A
=
+
=
°
=
The maximum junction temperature of the LX8819 can be
calculated using the following equation:
(
)
JA
2
REG
)
1
REG
(
D
A
J
P
T
θ
+
=
with:
(
)
()
2
OUT
2
OUT
)
MAX
(
IN
)
2
REG
(
D
1
OUT
1
OUT
)
MAX
(
IN
)
1
REG
(
D
I
V
P
and
I
V
P
=
=
Substituting the known values yields a maximum junction
temperature of:
()
C
140
T
W
C
30
W
375
.
1
W
75
.
1
C
50
T
P
T
W
375
.
1
A
5
.
0
V
5
.
2
V
25
.
5
P
W
75
.
1
A
5
.
0
V
5
.
1
V
25
.
5
P
J
JA
)
2
REG
(
D
)
1
REG
(
D
A
J
)
2
REG
(
D
)
1
REG
(
D
°
=
°
+
°
=
θ
+
=
=
=
This value is within the safe operating range of the
device under worst case conditions
It is important to note that although each output of the
regulator will produce up to 1A in current, the individual or
total power dissipation may limit the useful total current
draw. The junction temperature should be calculated for
each individual output as well as the combined outputs to
insure that maximum junction temperature in not exceeded.
LAYOUT CONSIDERATION
The layout must be done with low impedance paths for
VIN, VOUT1, VOUT2 and GND by using sufficiently
wide traces to avoid voltage drops and noise pick up. The
output capacitors must be placed as close as possible to the
voltage regulator output pins.
The input capacitor should be connected between VIN
and the ground plane with short leads.
Although it may not be immediately obvious, best load
regulation for the adjustable output is obtained when the
top of the voltage feedback resistor divider (R1) is
connected as close as possible to the case of the regulator;
not to the load.
The PCB copper can be used as a heatsink for the
surface mounted package.
Using the minimum size as
shown in the recommended pad layout (Figure 3), limits
the usable power to about 1W for an ambient temperature
of 50°C. Since most applications require greater than 2W
there is the need to provide additional heatsinking. This
can be accomplished by using additional copper area both
on the PCB surface, as shown in the possible heat sink
layout below, or to an embedded ground plane. Since the
die pad (copper tab) is in electrical contact with ground,
the designer can use thermal vias, on the surface of the
PCB, taking advantage of the heat-spreading (Cu) layer of
an internal ground plane.
Board Level
Ground
Plane
Component
Trace
B
A
Figure 3 –
Recommended Layout
Component
Component Trace
Ground Plane
Inner Power Plane
Backside Trace
VIAS
B
A
Figure 4 –
Ground Plane Heatsink
AA
PP
LL
IICC
AA
TT
IIOO
NN
SS
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