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参数资料
| 型号： | M1A3P1000-2FGG256I |
| 厂商： | Microsemi SoC |
| 文件页数： | 3/12页 |
| 文件大小： | 0K |
| 描述： | IC FPGA M1 1KB FLASH 1M 256FBGA |
| 标准包装： | 90 |
| 系列： | ProASIC3 |
| RAM 位总计： | 147456 |
| 输入/输出数： | 177 |
| 门数： | 1000000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FPBGA（17x17） |
ARM CortexTM-M1
Prod uct Br ief
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相关代理商/技术参数 |
参数描述 |
|---|---|
| M1A3P1000-2FGG484 | 功能描述:IC FPGA M1 1KB FLASH 1M 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| M1A3P1000-2FGG484I | 功能描述:IC FPGA M1 1KB FLASH 1M 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| M1A3P1000-2PQ144 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| M1A3P1000-2PQ144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| M1A3P1000-2PQ144I | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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