参数资料
| 型号： | M1A3P1000L-FGG484 |
| 厂商： | Microsemi SoC |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | IC FPGA M1 1KB FLASH 1M 484FBGA |
| 标准包装： | 40 |
| 系列： | ProASIC3L |
| RAM 位总计： | 147456 |
| 输入/输出数： | 300 |
| 门数： | 1000000 |
| 电源电压： | 1.14V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 484-BGA |
| 供应商设备封装： | 484-FPBGA（23x23） |
ARM CortexTM-M1
Prod uct Br ief
3
ARM Cortex-M1–Enabled FPGAs
ARM Cortex-M1 is available for use in a growing number
of
Actel
M1
devices.
These
include
M1AFS600,
M1AGL600, M1A3P1000, and a number of additional M1
devices. The devices listed have the features shown in the
following sections:
M1AFS600 Fusion
Actel Fusion Programmable System Chips (PSCs) are the
world’s first mixed-signal FPGAs. Fusion integrates a
12-bit analog-to-digital converter, as many as 40 analog
I/Os, up to 8 Mbits of flash memory, and FPGA fabric all
in a single device. When used in conjunction with a soft
processor such as ARM Cortex-M1, Actel Fusion devices
represent the definitive soft MCU platform.
M1AFS600 Features
Industry’s first mixed-signal FPGA
600,000 system gates – 13,824 logic tiles
ARM Cortex-M1 uses less than 30% of FPGA logic
4 Mbits flash, 108 kbits SRAM
30 analog inputs, 10 analog outputs
172 digital I/Os
2 PLLs, 1% RC oscillator, Xtal oscillator, RTC
M1AGL600 IGLOO FPGAs
The M1 IGLOO devices are reprogrammable, full-
featured flash FPGAs designed to meet the demanding
power and area requirements of today's portable
electronics. Featuring Flash*Freeze technology and
with operating voltages of 1.2 V / 1.5 V, these devices
offer the industry's lowest power consumption. M1
IGLOO
devices
give
designers
a
flexible
system
construction platform for building portable products
that offer maximum battery life.
M1AGL600 Features
Ultra-low power flash-based FPGA
600,000 system gates – 13,824 logic tiles
ARM Cortex-M1 uses less than 33% of FPGA logic
144 kbits SRAM, 235 digital I/Os
M1A3P1000 ProASIC3/E FPGAs
ProASIC3/E devices, the third generation of Actel Flash
FPGAs, offer industry-leading unit cost and lowest total
system cost—up to 504 kbits of SRAM, 350 MHz
operation, and best-in-class logic utilization. These
single-chip FPGAs require no boot ROMs or other
support chips and are highly secure, with 128-bit AES
encryption and FlashLock technology.
M1A3P1000 Features
Low-cost flash-based FPGA
1,000,000 system gates – 24,576 logic tiles
ARM Cortex-M1 uses less than 20% of FPGA logic
144 kbits SRAM
300 digital I/Os
Table 1
ARM Cortex-M1 Utilization Data
Device
Variant
Size (tiles)
RVDS
Size (tiles)
FlashPro
RAM Blocks
Device
Utilization (%)
M1 Fusion
No debug
4,452
–
4
M1AFS600
31
With debug
–
9,272
9,462
4
M1AFS600
68
M1 IGLOO 1.5 V
No debug
4,435
–
4
M1AGL600
31
With debug
–
9,250
9,440
4
M1AGL600
68
M1 IGLOO 1.2 V
No debug
4,435
–
4
M1AGL600
31
With debug
–
9,250
9,440
4
M1AGL600
68
M1 ProASIC3/E
No debug
4,435
–
4
M1A3PE1500
12
With debug
–
9,250
9,440
4
M1A3PE1500
25
Note: Configuration is 0 kbytes ITCM, 0 kbytes DTCM, small multiplier, 1interrupt, no OS extensions, little-endian, and debug as shown.
Refer to the Cortex-M1 Handbook for performance information.
相关PDF资料 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| M1A3P1000L-FGG484I | 功能描述:IC FPGA M1 1KB FLASH 1M 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3L 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| M1A3P1000L-PQ208 | 功能描述:IC FPGA M1 1KB FLASH 1M 208PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3L 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| M1A3P1000L-PQ208I | 功能描述:IC FPGA M1 1KB FLASH 1M 208PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3L 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| M1A3P1000L-PQG208 | 功能描述:IC FPGA M1 1KB FLASH 1M 208PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3L 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| M1A3P1000L-PQG208I | 功能描述:IC FPGA M1 1KB FLASH 1M 208PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3L 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
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