参数资料
型号: M1A3P600-FG484I
厂商: Microsemi SoC
文件页数: 3/12页
文件大小: 0K
描述: IC FPGA 1KB FLASH 600K 484-FBGA
标准包装: 40
系列: ProASIC3
RAM 位总计: 110592
输入/输出数: 235
门数: 600000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(23x23)
ARM CortexTM-M1
Prod uct Br ief
11
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully
characterized. Datasheets are designated as "Product Brief," "Advanced," and "Production." The definitions of these
categories are as follows:
Product Brief
The product brief is a summarized version of an advanced or production datasheet containing general product
information. This brief summarizes specific device and family information for unreleased products.
Advanced
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
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相关代理商/技术参数
参数描述
M1A3P600-FGG144 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
M1A3P600-FGG144ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P600-FGG144I 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
M1A3P600-FGG144PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P600-FGG256 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)