参数资料
型号: M1A3PE3000-2FGG484
厂商: Microsemi SoC
文件页数: 107/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 484-FBGA
标准包装: 40
系列: ProASIC3E
RAM 位总计: 516096
输入/输出数: 341
门数: 3000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(23x23)
ProASIC3E Flash Family FPGAs
Revision 13
2-35
1.5 V LVCMOS (JESD8-11)
Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-
purpose 1.5 V applications. It uses a 1.5 V input buffer and a push-pull output buffer.
Table 2-41 Minimum and Maximum DC Input and Output Levels
1.5 V
LVCMOS
VIL
VIH
VOL
VOH
IOL IOH IOSL
IOSH IIL1 IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmA mA
Max.
mA3
Max.
mA3 A4 A4
2 mA
–0.3 0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI
0.75 * VCCI
2
16
13
10 10
4 mA
–0.3 0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI
0.75 * VCCI
4
33
25
10 10
6 mA
–0.3 0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI
0.75 * VCCI
6
39
32
10 10
8 mA
–0.3 0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI
0.75 * VCCI
8
55
66
10 10
12 mA
–0.3 0.30 * VCCI 0.7 * VCCI
3.6
0.25 * VCCI
0.75 * VCCI
12 12
55
66
10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V< VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Figure 2-10 AC Loading
Table 2-42 AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
0
1.5
0.75
35
Note: *Measuring point = Vtrip. See Table 2-15 on page 2-18 for a complete table of trip points.
Test Point
Enable Path
Datapath
35 pF
R = 1 k
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
相关PDF资料
PDF描述
W25Q64FVSSIG IC SPI FLASH 64MBIT 8SOIC
EP1AGX35DF780I6 IC ARRIA GX FPGA 35K 780FBGA
EP1AGX35DF780I6N IC ARRIA GX FPGA 35K 780FBGA
EP4CE115F23C9L IC CYCLONE IV FPGA 115K 484-FBGA
EP4CE115F23C8 IC CYCLONE IV FPGA 115K 484-FBGA
相关代理商/技术参数
参数描述
M1A3PE3000-2FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
M1A3PE3000-2FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE3000-2FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE3000-2FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
M1A3PE3000-2FGG896PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs