参数资料
| 型号： | M1A3PE3000-PQG208I |
| 厂商： | Microsemi SoC |
| 文件页数： | 70/162页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 1KB FLASH 3M 208-PQFP |
| 标准包装： | 24 |
| 系列： | ProASIC3E |
| RAM 位总计： | 516096 |
| 输入/输出数： | 147 |
| 门数： | 3000000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 208-BFQFP |
| 供应商设备封装： | 208-PQFP（28x28） |
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ProASIC3E Flash Family FPGAs
Revision 13
5-11
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "ProASIC3E Device Status" table on page II, is designated as either "Product Brief,"
"Advance," "Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
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| EP20K200EFI484-2X | IC APEX 20KE FPGA 200K 484-FBGA |
| EP20K200EFC484-1X | IC APEX 20KE FPGA 200K 484-FBGA |
| EMC60DRYN-S13 | CONN EDGECARD 120POS .100 EXTEND |
| EMC60DRYH-S13 | CONN EDGECARD 120POS .100 EXTEND |
相关代理商/技术参数 |
参数描述 |
|---|---|
| M1A3PE3000-PQG896 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs |
| M1A3PE3000-PQG896ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs |
| M1A3PE3000-PQG896I | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs |
| M1A3PE3000-PQG896PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs |
| M1A3PL-DEV-KIT | 功能描述:KIT DEV ARM CORTEX-M1 PROASIC3L RoHS:是 类别:编程器，开发系统 >> 通用嵌入式开发板和套件（MCU、DSP、FPGA、CPLD等） 系列:- 标准包装:1 系列:PICDEM™ 类型:MCU 适用于相关产品:PIC10F206，PIC16F690，PIC16F819 所含物品:板，线缆，元件，CD，PICkit 编程器 产品目录页面:659 (CN2011-ZH PDF) |
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