参数资料
型号: M1A3PE3000L-FG484
厂商: Microsemi SoC
文件页数: 100/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 484-FBGA
标准包装: 40
系列: ProASIC3EL
RAM 位总计: 516096
输入/输出数: 341
门数: 3000000
电源电压: 1.14V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(23x23)
ProASIC3E DC and Switching Characteristics
2-28
Revision 13
Table 2-32 3.3 V LVCMOS Wide Range Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.7 V
Drive
Strength
Equivalent
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP
tDIN tPY tPYS tEOUT tZL
tZH
tLZ tHZ tZLS tZHS Units
100 A
4 mA
Std.
0.66 17.02 0.04 1.83 2.38 0.43 17.02 13.74 4.16 3.78 20.42 17.14
ns
–1
0.56 14.48 0.04 1.55 2.02 0.36 14.48 11.69 3.54 3.21 17.37 14.58
ns
–2
0.49 12.71 0.03 1.36 1.78 0.32 12.71 10.26 3.11 2.82 15.25 12.80
ns
100 A
8 mA
Std.
0.66 12.16 0.04 1.83 2.38 0.43 12.16 9.78 4.70 4.74 15.55 13.17
ns
–1
0.56 10.34 0.04 1.55 2.02 0.36 10.34 8.32 4.00 4.03 13.23 11.20
ns
–2
0.49
9.08 0.03 1.36 1.78 0.32
9.08
7.30 3.51 3.54 11.61 9.84
ns
100A
12 mA
Std.
0.66
9.32 0.04 1.83 2.38 0.43
9.32
7.62 5.06 5.36 12.71 11.02
ns
–1
0.56
7.93 0.04 1.55 2.02 0.36
7.93
6.48 4.31 4.56 10.81 9.37
ns
–2
0.49
6.96 0.03 1.36 1.78 0.32
6.96
5.69 3.78 4.00 9.49
8.23
ns
100 A
16 mA
Std.
0.66
8.69 0.04 1.83 2.38 0.43
8.69
7.17 5.14 5.53 12.08 10.57
ns
–1
0.56
7.39 0.04 1.55 2.02 0.36
7.39
6.10 4.37 4.71 10.28 8.99
ns
–2
0.49
6.49 0.03 1.36 1.78 0.32
6.49
5.36 3.83 4.13 9.02
7.89
ns
100 A
24 mA
Std.
0.66
8.11 0.04 1.83 2.38 0.43
8.11
7.13 5.23 6.13 11.50 10.52
ns
–1
0.56
6.90 0.04 1.55 2.02 0.36
6.90
6.06 4.45 5.21 9.78
8.95
ns
–2
0.49
6.05 0.03 1.36 1.78 0.32
6.05
5.32 3.91 4.57 8.59
7.86
ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 A. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. Software default selection highlighted in gray.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
相关PDF资料
PDF描述
ASM44DRXI CONN EDGECARD 88POS DIP .156 SLD
A3PE3000L-FG484 IC FPGA 1KB FLASH 3M 484-FBGA
EMC60DRTS-S734 CONN EDGECARD 120PS DIP .100 SLD
A3PE3000L-FGG484 IC FPGA 1KB FLASH 3M 484-FBGA
AMC25DRYI-S734 CONN EDGECARD 50POS DIP .100 SLD
相关代理商/技术参数
参数描述
M1A3PE3000L-FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3EL 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
M1A3PE3000L-FG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA
M1A3PE3000L-FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3EL 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE3000L-FG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3EL 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
M1A3PE3000L-FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 620 I/O 896FBGA