参数资料
型号: M251206BB2209JP500
厂商: Vishay Beyschlag
文件页数: 3/5页
文件大小: 0K
描述: RES 22 OHM 1/4W 5% 1206 SMD
标准包装: 1
系列: M25SI
电阻(欧姆): 22
功率(瓦特): 0.25W,1/4W
复合体: 薄膜
特点: 阻燃涂层,可熔,脉冲耐受
温度系数: ±100ppm/°C
容差: ±5%
封装/外壳: 1206(3216 公制)
尺寸/尺寸: 0.126" L x 0.063" W(3.20mm x 1.60mm)
高度: 0.024"(0.60mm)
端子数: 2
包装: 标准包装
其它名称: M251206-22BDKR
M25SI
Fusible Thin Film Chip Resistor
Vishay Draloric
DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
Al 2 O 3 ceramic substrate. Specially designed inner contacts
are deposited on both sides. A special laser is used to
achieve the target value by smoothly cutting a meander
groove in the resistive layer without damaging the ceramics.
The resistor elements are covered by a protective coating
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The use of
conformal coating is not permitted. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes.
Solderability is specified for 2 years after production or
requalification. The permitted storage time is 20 years. The
immunity of the plating against tin whisker growth has been
proven under extensive testing.
designed for electrical, mechanical and climatic protection.
All products comply with the
GADSL (1)
and the
The terminations receive a final pure tin on nickel plating.
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
The result of the determined production is verified by an
extensive testing procedure. Only accepted products are laid
directly into the paper tape in accordance with IEC 60286-3 .
hazardous substances. This includes full compliance with
the following directives:
? 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
ASSEMBLY
? 2002/95/EC Restriction of
the
use
of
Hazardous
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1 (3) . The encapsulation is resistant to all cleaning
Notes
Substances directive (RoHS)
? 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
(1)
(2)
(3)
Global Automotive Declarable Substance List, see www.gadsl.org
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issues →
environment policy → chemicals → chemicals for electronics
The quoted IEC standards are also released as EN standards with the same number and identical contents
FUNCTIONAL PERFORMANCE
1000
100
10
1
0.1
0.01
1000
100
10
0.001
0
1
2
3
4
5
6
7
8
9 10
1
1
10
100
1000
10 000
Fusin g Performance
Power in W
Resistance Value in Ω
Maximum Applicable Volta g e after Fusin g
Document Number: 20031
Revision: 17-Sep-09
For technical questions, contact: thinfilmchip@vishay.com
www.vishay.com
237
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