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参数资料
| 型号： | M366S1623DT0-C80 |
| 厂商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | PC100 Unbuffered DIMM |
| 中文描述： | PC100的无缓冲DIMM |
| 文件页数： | 6/9页 |
| 文件大小： | 136K |
| 代理商： | M366S1623DT0-C80 |
M366S1623DT0
PC100 Unbuffered DIMM
Rev. 0.0 Jun. 1999
AC OPERATING TEST CONDITIONS
(V
DD
= 3.3V
±
0.3V, T
A
= 0 to 70
°
C)
Parameter
Value
Unit
AC input levels (Vih/Vil)
2.4/0.4
V
Input timing measurement reference level
1.4
V
Input rise and fall time
tr/tf = 1/1
ns
Output timing measurement reference level
1.4
V
Output load condition
See Fig. 2
3.3V
1200
870
Output
50pF
V
OH
(DC) = 2.4V, I
OH
= -2mA
V
OL
(DC) = 0.4V, I
OL
= 2mA
Vtt = 1.4V
50
Output
50pF
Z0 = 50
(Fig. 2) AC output load circuit
(Fig. 1) DC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
5. For -80/1H/1L, tRDL=1CLK and tDAL=1CLK+20ns is also supported .
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + 20ns.
Notes :
Parameter
Symbol
Version
Unit
Note
-80
-1H
-1L
Row active to row active delay
t
RRD
(min)
16
20
20
ns
1
RAS to CAS delay
t
RCD
(min)
20
20
20
ns
1
Row precharge time
t
RP
(min)
20
20
20
ns
1
Row active time
t
RAS
(min)
48
50
50
ns
1
t
RAS
(max)
100
us
Row cycle time
t
RC
(min)
68
70
70
ns
1
Last data in to row precharge
t
RDL
(min)
2
CLK
2,5
Last data in to Active delay
t
DAL
(min)
2 CLK + 20 ns
-
5
Last data in to new col. address delay
t
CDL
(min)
1
CLK
2
Last data in to burst stop
t
BDL
(min)
1
CLK
2
Col. address to col. address delay
t
CCD
(min)
1
CLK
3
Number of valid output data
CAS latency=3
2
ea
4
CAS latency=2
-
1
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| M366S1623ET0 | 制造商:SAMSUNG 制造商全称:Samsung semiconductor 功能描述:16Mx64 SDRAM DIMM based on 8Mx8, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD |
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