参数资料
型号: M37272M6-XXXFP
元件分类: 微控制器/微处理器
英文描述: 8-BIT, MROM, 8.1 MHz, MICROCONTROLLER, PDSO42
封装: 0.450 INCH, 0.80 MM PITCH, PLASTIC, SSOP-42
文件页数: 91/145页
文件大小: 1928K
代理商: M37272M6-XXXFP
2
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER with CLOSED CAPTION DECODER
and ON-SCREEN DISPLAY CONTROLLER
M37272M6/M8–XXXSP/FP, M37272MA–XXXSP
M37272E8SP/FP, M37272EFSP
MITSUBISHI MICROCOMPUTERS
Rev. 1.3
TABLE OF CONTENTS
1. DESCRIPTION .......................................................................... 1
2. FEAUTURES ............................................................................. 1
3. APPLICATION ............................................................................ 1
4. PIN CONFIGURATION .............................................................. 3
5. FUNCTIONAL BLOCK DIAGRAM ............................................. 4
6. PERFORMANCE OVERVIEW ................................................... 5
7. PIN DESCRIPTION ................................................................... 7
8. FUNCTIONAL DESCRIPTION ................................................. 11
8.1 CENTRAL PROCESSING UNIT (CPU) .................... 11
8.2 MEMORY .................................................................. 12
8.3 INTERRUPTS ........................................................... 18
8.4 TIMERS ..................................................................... 23
8.5 SERIAL I/O ................................................................ 26
8.6 MULTI-MASTER I2C-BUS INTERFACE .................... 29
8.7 PWM OUTPUT CIRCUIT .......................................... 42
8.8 A-D COMPARATOR .................................................. 46
8.9 ROM CORRECTION FUNCTION ............................. 48
8.10 DATA SLICER ......................................................... 49
8.11 OSD FUNCTIONS ................................................... 60
8.11.1 Display Position ....................................... 65
8.11.2 Dot size .................................................... 69
8.11.3 Clock for OSD .......................................... 70
8.11.4 Field Determination Display ..................... 71
8.11.5 Memory For OSD ..................................... 73
8.11.6 Character Color ....................................... 77
8.11.7 Character Background Color ................... 77
8.11.8 OUT1, OUT2 Signals ............................... 78
8.11.9 Attribute .................................................... 79
8.11.10 Multiple Display ...................................... 84
8.11.11 Automatic Solid Space Function ............ 85
8.11.12 Window Function ................................... 86
8.11.13 OSD Output Pin Control ........................ 88
8.11.14 Raster Coloring Function ....................... 89
8.12. SOFTWARE RUNAWAY DETECT FUNCTION ..... 91
8.13. RESET CIRCUIT .................................................... 92
8.14. CLOCK GENERATING CIRCUIT ........................... 93
8.15. DISPLAY OSCILLATION CIRCUIT ........................ 96
8.16. AUTO-CLEAR CIRCUIT ......................................... 96
8.17. ADDRESSING MODE ............................................ 96
8.18. MACHINE INSTRUCTIONS ................................... 96
9. PROGRAMMING NOTES ........................................................ 96
10. ABSOLUTE MAXIMUM RATINGS ......................................... 97
11. RECOMMENDED OPERATING CONDITIONS ..................... 97
12. ELECTRIC CHARACTERISTICS .......................................... 98
13. A-D COMPARISON CHARACTERISTICS ........................... 100
14. MULTI-MASTER I2C-BUS BUS LINE CHARACTERISTICS ......... 100
15. PROM PROGRAMMING METHOD ..................................... 101
16. DATA REQUIRED FOR MASK ORDERS ............................ 102
17. MASK CONFIRMATION FORM ........................................... 103
18. MARK SPECIFICATION FORM ........................................... 112
19. ONE TIME PROM VERSIONS M37272E8SP/FP,
M37272EFSP MARKING ..................................................... 114
20. APPENDIX ........................................................................... 115
21. PACKAGE OUTLINE ........................................................... 140
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