参数资料
型号: M7A3P1000-2PQ208
厂商: Microsemi SoC
文件页数: 188/220页
文件大小: 0K
描述: IC FPGA 1KB FLASH 1M 208-PQFP
标准包装: 24
系列: ProASIC3
RAM 位总计: 147456
输入/输出数: 154
门数: 1000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页当前第188页第189页第190页第191页第192页第193页第194页第195页第196页第197页第198页第199页第200页第201页第202页第203页第204页第205页第206页第207页第208页第209页第210页第211页第212页第213页第214页第215页第216页第217页第218页第219页第220页
Revision 13
1-1
1 – ProASIC3 Device Family Overview
General Description
ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS family. Nonvolatile flash technology gives ProASIC3 devices
the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is
reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable
designers to create high-density systems using existing ASIC or FPGA design flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030
devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates, supported
with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAM-
based FPGAs, flash-based ProASIC3 devices allow all functionality to be Instant On; no external boot
PROM is required. On-board security mechanisms prevent access to all the programming information
and enable secure remote updates of the FPGA logic. Designers can perform secure remote in-system
reprogramming to support future design iterations and field upgrades with confidence that valuable
intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using the
industry-standard AES algorithm. The ProASIC3 family device architecture mitigates the need for ASIC
migration at higher user volumes. This makes the ProASIC3 family a cost-effective ASIC replacement
solution, especially for applications in the consumer, networking/ communications, computing, and
avionics markets.
Security
The nonvolatile, flash-based ProASIC3 devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3 devices incorporate FlashLock, which provides a
unique combination of reprogrammability and design security without external overhead, advantages that
only an FPGA with nonvolatile flash programming can offer.
ProASIC3 devices utilize a 128-bit flash-based lock and a separate AES key to provide the highest level
of protection in the FPGA industry for intellectual property and configuration data. In addition, all
FlashROM data in ProASIC3 devices can be encrypted prior to loading, using the industry-leading
AES-128 (FIPS192) bit block cipher encryption standard. The AES standard was adopted by the National
Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3
devices have a built-in AES decryption engine and a flash-based AES key that make them the most
comprehensive programmable logic device security solution available today. ProASIC3 devices with
AES-based security provide a high level of protection for remote field updates over public networks such
as the Internet, and are designed to ensure that valuable IP remains out of the hands of system
overbuilders, system cloners, and IP thieves.
ARM-enabled ProASIC3 devices do not support user-controlled AES security mechanisms. Since the
ARM core must be protected at all times, AES encryption is always on for the core logic, so bitstreams
are always encrypted. There is no user access to encryption for the FlashROM programming data.
Security, built into the FPGA fabric, is an inherent component of the ProASIC3 family. The flash cells are
located beneath seven metal layers, and many device design and layout techniques have been used to
make invasive attacks extremely difficult. The ProASIC3 family, with FlashLock and AES security, is
unique in being highly resistant to both invasive and noninvasive attacks.
相关PDF资料
PDF描述
M7A3P1000-2PQG208 IC FPGA 1KB FLASH 1M 208-PQFP
AYM31DTMT CONN EDGECARD 62POS R/A .156 SLD
EPF10K30AQC240-2N IC FLEX 10KA FPGA 30K 240-PQFP
ACB75DHLR CONN EDGECARD 150PS .050 DIP SLD
A1010B-PQ100C IC FPGA 1200 GATES 100-PQFP COM
相关代理商/技术参数
参数描述
M7A3P1000-2PQ208I 功能描述:IC FPGA 1KB FLASH 1M 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M7A3P1000-2PQG208 功能描述:IC FPGA 1KB FLASH 1M 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
M7A3P1000-2PQG208I 功能描述:IC FPGA 1KB FLASH 1M 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M7A3P1000-FG144 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
M7A3P1000-FG144I 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)