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参数资料
| 型号： | MA4E2062L-1068 |
| 元件分类： | 射频混频器 |
| 英文描述： | SILICON, LOW BARRIER SCHOTTKY, X BAND, MIXER DIODE |
| 封装： | PLASTIC, SOT-143, 4 PIN |
| 文件页数： | 3/3页 |
| 文件大小： | 34K |
| 代理商： | MA4E2062L-1068 |
Silicon Schottky Diode Ring Quad Chips
MA4E2062 Series
M/A-COM Division of AMP Incorporated n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
The preliminary specifications data sheet contains typical electrical specifications which may change prior to final introduction.
Handling and Assembly
The MA4E2062 chip and all Schottky barrier junctions, are ESD
sensitive. It is necessary to adhere to the proper ESD handling
precautions.
Die attach may be performed using either epoxy or solder. To
obtain a consistently strong attachment when using epoxies ob-
serve the vendor recommended cleanliness, epoxy pot life, cur-
ing, and carrier fluids. The cleanliness, time, temperature control
and tooling are essential for a good epoxy attachment.
The
maximum soldering temperature is 290°C for 5 seconds. Solders
that disolve gold metalization are not recommended.
All electrical connections to the quad must be made through the
four bondpads on the topside of the chip. The bondpads are
junction-isolated
from
the
chip’s
backside.
Thermo-
compression wedge bonding using 0.0007” to 0.001” diameter
gold wire is recommended. The leads should be kept as short as
possible (see model).
For more information on die attach and wire bonding see Bond-
ing and Handling Procedures for Chip Diode Devices M/A-
COM Application Note M541.
Ordering Information
Model No.
Delivery Form and Barrier Heights
MA4E2062L
Chip Tape Frame with Low Barrier Height
MA4E2062L
Chip Gel Pack with Low Barrier Height
MA4E2062L-1068
SOT-143 Bulk Pack with Low Barrier Height
MA4E2062L-1068T
SOT-143 Tape and Reel with Low Barrier Height
MA4E2062M
Chip Tape Frame with Medium Barrier Height
MA4E2062M
Chip Gel Pack with Medium Barrier Height
MA4E2062M-1068
SOT-143 Bulk Pack with Medium Barrier Height
MA4E2062M-1068T
SOT-143 Tape and Reel with Medium Barrier Height
MA4E2062H
Chip Tape Frame with High Barrier Height
MA4E2062H
Chip Gel Pack High Barrier Height
MA4E2062H-1068
SOT-143 Bulk Pack with High Barrier Height
MA4E2062H-1068T
SOT-143 Tape and Reel with High Barrier Height
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MA4E2062L-1068T | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Silicon Schottky Diode Ring Quads |
| MA4E2062M | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Silicon Schottky Diode Ring Quads |
| MA4E2062M-1068T | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Silicon Schottky Diode Ring Quads |
| MA4E2062M-1213 | 制造商:M/A-COM Technology Solutions 功能描述:DIODE,SCHOTTKY,CHIP,SI - Bulk |
| MA4E2072 | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Surface Mount Schottky Crossover Quads |
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