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参数资料
| 型号： | MA4E2501L-1290T |
| 元件分类： | 射频混频器 |
| 英文描述： | SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE |
| 封装： | CASE 1290, 2 PIN |
| 文件页数： | 2/3页 |
| 文件大小： | 103K |
| 代理商： | MA4E2501L-1290T |
SURMOUNTTM Low Barrier 0201 Footprint
Silicon Schottky Diodes
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
2
Series V1
MA4E2501-1290
Electrical Specifications @ 25 °C
Handling
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum
pickups
is
strongly
recommended
for
individual components. The top surface of the die
has a protective polyimide coating to minimize
damage.
The rugged construction of these SurMount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry
standard electrostatic discharge (ESD) control is
required at all times, due to the sensitive nature of
Schottky junctions.
Bulk handling should insure that abrasion and
mechanical shock are minimized.
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the
bottom surface of these devices, and are opposite
the active junction. The devices are well suited for
higher temperature solder attachment onto hard
substrates. 80Au/20Sn and Sn63/Pb37 solders are
acceptable for usage. Die attach with Electrically
Conductive Silver Epoxy is Not Recommended.
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When soldering
to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are
aligned with the circuit board mounting pads. Reflow
the solder paste by applying Equal heat to the circuit
at both die-mounting pads. The solder joint must Not
be made one at a time, creating un-equal heat flow
and thermal stress. Solder reflow should Not be
performed by causing heat to flow through the top
surface of the die. Since the HMIC glass is
transparent, the edges of the mounting pads can be
visually inspected through the die after die attach is
completed.
Absolute Maximum Ratings @ 25 °C
(Unless Otherwise Noted)
1
1. Operation of this device above any one of these parameters
may cause permanent damage.
Parameter
Absolute Maximum
Operating Temperature
-40 °C to +150 °C
Storage Temperature
-40 °C to +150 °C
Forward Current
20 mA
Reverse Voltage
5 V
RF C.W. Incident Power
+ 20 dBm
RF & DC Dissipated Power
50 mW
Rt is the dynamic slope resistance where
Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA)
Model
Number
Type
Recommended
Frequency Range
Vf @ 1 mA
( mV )
Vb @ 10 uA
( V )
Ct @ 0V
( pF )
Rt Slope Resistance
( Vf1 - Vf2 )/(10.5mA-9.5mA )
(
)
MA4E2501L-
1290
Low
Barrier
DC - 18 GHz
330 Max
300 Typ
3 Min
5 Typ
0.12 Max
0.10 Typ
10 Typ
14 Max
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MA4E2501L-1290W | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes |
| MA4E2502 | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Low, Medium, and High |
| MA4E2502_V9 | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Low, Medium, and High |
| MA4E2502H | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes |
| MA4E2502H-1246 | 功能描述:肖特基二极管与整流器 RoHS:否 制造商:Skyworks Solutions, Inc. 产品:Schottky Diodes 峰值反向电压:2 V 正向连续电流:50 mA 最大浪涌电流: 配置:Crossover Quad 恢复时间: 正向电压下降:370 mV 最大反向漏泄电流: 最大功率耗散:75 mW 工作温度范围:- 65 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SOT-143 封装:Reel |
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