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参数资料
| 型号： | MA4E2544L |
| 元件分类： | 射频混频器 |
| 英文描述： | SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE |
| 文件页数： | 4/6页 |
| 文件大小： | 108K |
| 代理商： | MA4E2544L |
Surface Mount Chip Monolithic Low Barrier Schottky Diodes MA4E2500 Surmount Series
V3.00
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
s
Asia/Pacic: Tel. +81 3 3263 8761
s
Europe: Tel. +44 (1344) 869 595
Fax (800) 618-8883
Fax +81 3 3263 8769
Fax +44 (1344) 300 020
4
Specications Subject to Change Without Notice.
Handling and Bonding
The rugged construction of these SurMount chip devices
allows the use of standard handling and die attach
techniques. It is important to note that industry standard
electrostatic discharge (ESD) control is required at all
times, due to the nature of Schottky junctions.
Handling
The devices can be handled with #3c tweezers for
manual placement. The top surface of the die has a
protective coating to minimize damage. These devices
are compatible with vacuum pencil or automatic pick
and place installation.
Bonding
Die attach for these devices is made simple through the
use of surface mount die attach technology. Mounting
pads are conveniently located on the bottom surface of
these devices, and are removed from the active junction
locations. The devices are well suited for high tempera-
ture solder attachment onto hard substrates. The use of
80% gold 20% tin solder is recommended, but lead tin
solders are acceptable. Conductive epoxy may also be
used for die attach.
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. We recommend utilizing vacu-
um tip and force of 60 to 100 grams applied normal to
the top surface of the device. When soldering to soft sub-
strates, it is recommended to use a lead-tin interface at
the circuit board mounting pads. Position the die so that
its mounting pads are aligned with the circuit board
mounting pads, and reow the solder by heating the cir-
cuit trace near both mounting pads while applying 60 to
100 grams force perpendicular to the top surface of the
die. Solder reow must not be accomplished by causing
heat to ow through the die. The solder joint must not
be made one at a time. A multi-tip soldering iron should
be used to simultaneously reow both solder joints.
Since the HMIC glass is transparent, the edges of the
mounting pads closest to each other can be visually
inspected through the die after die attach is completed.
Bottom View
Top View
Cross Section
Top View
Bottom View
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MA4E2544L-1282 | 制造商:M/A-COM Technology Solutions 功能描述:RF SCHOTTKY DIODE |
| MA4E2544L-1282T | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Low Barrier Silicon Schottky Cross-Over Quad Series |
| MA4E2544L-1282W | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Low Barrier Silicon Schottky Cross-Over Quad Series |
| MA4E5 | 制造商:EDAL 制造商全称:EDAL 功能描述:SILICON GENERAL PURPOSE 3.0 AMP DIODES |
| MA4E514M4 | 制造商: 功能描述: 制造商:undefined 功能描述: |
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