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参数资料
| 型号： | MA4FCP300-W |
| 元件分类： | PIN二极管 |
| 英文描述： | SILICON, PIN DIODE |
| 封装： | FLIP CHIP-2 |
| 文件页数： | 2/4页 |
| 文件大小： | 107K |
| 代理商： | MA4FCP300-W |
Silicon Flip Chip PIN Diode
MA4FCP300
V 1.00
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
2
1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance, Cp.
2. Series resistance RS is equivalent to the total diode series resistance including the junction resistance Rj.
3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.
4. Steady-state thermal resistance measured with die mounted in an ODS-186 package.
Electrical Specifications @ TA = + 25 °C
Parameters @ Conditions
Symbol
Units
Min.
Typ.
Max.
Total Capacitance @ -10 V, 1 MHz
1
CT
pF
0.045
0.050
Total Capacitance @ -10 V, 1 GHz
1,3
CT
pF
0.025
Series Resistance @ +50 mA
2,3 , 100 MHz
RS
2.1
Series Resistance @ +50 mA
2,3 , 1 GHz
RS
2.6
Forward Voltage @ +100 mA
VF
V
1.1
1.5
Reverse Voltage @ -10
A
VR
V
l -70 l
l -100 l
Reverse Current @ -70 V
IR
nA
l -100 l
50 - 90% Lifetime @ +10 mA / -6 mA
TL
ns
140
Steady State Thermal Resistance
4
θ
° C/W
450
Mounting Techniques
These devices were designed for insertion onto hard or soft
substrates with the junction side down. They can be mounted
with electrically conductive epoxy or with a low temperature
solder preform.
The die can also be assembled with the
junction side up, and wire or ribbon bonds made to the pads.
Solder Die Attach Using
Electrically Conductive Ag Epoxy
and Solder
These chips are designed to be inserted onto hard or soft
substrates with the junction side down. They should be
mounted onto silkscreened circuits using
Electrically
Conductive Ag Epoxy, approximately 1-2 mils in thickness
and
cured
at
approximately
90
°C
to
150
°C
per
manufacturer’s schedule . For extended cure times >30
minutes, temperatures must be below 200 °C.
Sn Rich Solders are not recommended due to the Tungsten
Metallization scheme beneath the gold contacts. Indalloy or
80 Au/20 Sn Solders are acceptable. Maximum soldering
temperature must be <300 °C for <10 sec.
Assembly Considerations
The following precautions should be observed for successful
assembly of the die.
Cleanliness
These chips should be handled in a clean environment. Do not
attempt to clean die after installation.
ESD
These devices very susceptible to ESD and are rated Class 0
(0-199
V)
per
HBM
MIL-STD-883,
method
3015.7
[C = 100 pF
±10%, R = 1.5k ±1%]. Even though tested die
pass 100 V ESD, they must be handled in a static-free
environment
General Handling
The protective polymer coating on the active areas of these
devices provides scratch protection, particularly for the metal
airbridge that contacts the anode. Die can be handled with
tweezers or vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
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