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参数资料
| 型号： | MA4FCP305 |
| 元件分类： | PIN二极管 |
| 英文描述： | SILICON, PIN DIODE |
| 封装： | ROHS COMPLIANT, FLIP CHIP-2 |
| 文件页数： | 3/3页 |
| 文件大小： | 94K |
| 代理商： | MA4FCP305 |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
3
Flip Chip PIN Diode
RoHS Compliant
M/A-COM Products
Rev. V4
MA4FCP305
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
These devices were designed for insertion onto hard or soft substrates with the junction side down. They can be
mounted with electrically conductive epoxy or with a low temperature solder preform. However,
Sn rich solders
are not recommended due to the tungsten metallization scheme beneath the gold contacts. Indalloy or
80/20, Au/Sn, solders are acceptable. Maximum soldering temperature must be < 300°C for < 10 sec. These
chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be
mounted onto silkscreened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in
thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times,
> 30 minutes, temperatures must be below 200 °C. The die can also be assembled with the junction side up,
and wire or ribbon bonds made to the pads.
Circuit Mounting Dimensions ( Inches )
Ordering Information
The MA4FCP305 flip chip diode may be ordered in either waffle packs, tape and reel or 6” rings mounted on
tape per the table below. Tape and reel dimensions are provided in Application Note M513 located on the
M/A-COM website @ www.macom.com.
Part Number
Packaging
MA4FCP305
Die in Waffle Pack
MADP-007161-01269T
Tape & Reel
MADP-000305-12690R
Wafer on Tape Frame
0.012” (2) PL
0.008”
(2) PL
0.013”
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MA4FCP305-W | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Silicon Flip Chip PIN Diode |
| MA4FPC | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:PIN Diodes for Microwave Switch Designs |
| MA4FSR-A10.5 | 功能描述:环形公制连接器 M23 A Flexgrip Exit Diameter 10.5mm RoHS:否 制造商:3M Electronic Solutions Division 产品类型:Connectors 系列:M12 外壳类型:Plug 触点数量:4 安装风格:Cable 端接类型:Solder Cup 电流额定值:4 A |
| MA4FSR-A12.8 | 功能描述:环形公制连接器 M23 A Flexgrip Exit Diameter 12-8mm RoHS:否 制造商:3M Electronic Solutions Division 产品类型:Connectors 系列:M12 外壳类型:Plug 触点数量:4 安装风格:Cable 端接类型:Solder Cup 电流额定值:4 A |
| MA4FSR-A8.5 | 功能描述:环形公制连接器 M23 A Flexgrip Exit Diameter 8.5mm RoHS:否 制造商:3M Electronic Solutions Division 产品类型:Connectors 系列:M12 外壳类型:Plug 触点数量:4 安装风格:Cable 端接类型:Solder Cup 电流额定值:4 A |
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