参数资料
型号: MA4P4006-1091T
元件分类: PIN二极管
英文描述: SILICON, PIN DIODE
封装: ROHS COMPLIANT, LEADLESS, CERAMIC, CASE 1091, SMQ, MELF-2
文件页数: 4/12页
文件大小: 1502K
代理商: MA4P4006-1091T
High Power PIN Diodes
V12
MA4P HIPAX
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400
India Tel: +91.80.4155721
China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
12
HIPAX PIN diodes are designed to meet most environmental and electrical requirements and may be ordered
screened to MIL-STD-750 specifications as described in the table below.
TEST
METHOD
DESCRIPTION/ CONDITIONS
Moisture Resistance
1021
85°C, 85% Relative Humidity, 168 hrs
High Temperature Storage
1031
+175°C , 250 Hours
HTRB
1038
80% of rated VR, 50°C, 96 Hours
Temperature Shock
1051
-65°C to +175°C, 20 Cycles
Fine Leak
1071 Cond. H
1 X 10-7 CC/Sec
Constant Acceleration
2006
20,000 G’s
Solderability
2026
IPC/JDEC J-STD-02
Tension1
2036.3 Cond. A
2 Lbs., 30 Seconds
Lead Fatigue1
2036.3 Cond. E
3 Cycles, 8 oz., 90°,
Note:
1) Test applicable to HIPAX axially leaded devices only.
Environmental Ratings
.060” Min
Axial Leaded HIPAX Assembly Recommendations
Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming the
bend no closer than .060 inches from the body of the part. Bending the lead < 0.060 inches from the body of the part
is not recommended and may cause internal damage to the chip. Appropriate fixturing should be used.
Devices may be soldered using standard 60Sn/40Pb or any RoHS compliant solders. Axial leads are tin plated 50μm
thick to ensure an optimum connection.
For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website.
Case Style 401 & 402
Internal Construction
Case Style 401 & 402
Minimum Bend Distance
Package Style
Quantity Per Reel
Bulk Devices Per Bag
401T
500 or 1000
N/A
402
N/A
100
Ordering Information
Axial leaded diodes are available in tape and reel or bulk in quantities shown in the table below
Passivated Chip
Cathode Band
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