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参数资料
| 型号： | MAUPS360E3 |
| 厂商： | MICROSEMI CORP |
| 元件分类： | 整流器 |
| 英文描述： | 3 A, 60 V, SILICON, RECTIFIER DIODE |
| 封装： | ROHS COMPLIANT, PLASTIC, POWERMITE3, 3 PIN |
| 文件页数： | 1/5页 |
| 文件大小： | 358K |
| 代理商： | MAUPS360E3 |
UPS360e3
3 A Schottky Barrier Rectifier
DESCRIPTION
This UPS360e3 in the Powermite3 package is a high efficiency Schottky rectifier
that is also RoHS compliant offering high current/power capabilities previously
found only in much larger packages. They are ideal for SMD applications that
operate at high frequencies. In addition to its size advantages, the Powermite3
package includes a full metallic bottom that eliminates the possibility of solder flux
entrapment during assembly and a unique locking tab act as an efficient heat path to
the heat-sink mounting. Its innovative design makes this device ideal for use with
automatic insertion equipment.
IMPORTANT:
Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25 C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60
V
RMS Reverse Voltage
V R (RMS)
42
V
Average Rectified Output Current
Io
3
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
on Rated Load
IFSM
100 @ 25C
50 @ 100C
A
Storage Temperature
TSTG
-55 to +150
C
Junction Temperature
TJ
-55 to +125
C
THERMAL CHARACTERISTICS
Thermal Resistance
Junction-to-case (bottom)
RθJC
3.2
C/ Watt
Junction to ambient (1)
RθJA
65
C/ Watt
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print
Powermite 3
KEY FEATUR ES
Very low thermal resistance package
RoHS Compliant with e3 suffix part number
Guard-ring-die construction for transient
protection
Efficient heat path with Integral locking bottom
metal tab
Low forward voltage
Full metallic bottom eliminates flux entrapment
Compatible with automatic insertion
Low profile-maximum height of 1mm
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and
JANS are available by adding MQ, MX, MV, or
MSP prefixes respectively to part numbers.
For example, designate MXUPS360e3 for a
JANTX (consult factory for Tin-Lead plating).
Optional 100% avionics screening available by
adding MA prefix for 100% temperature cycle,
thermal impedance and 24 hours HTRB
(consult factory for Tin-Lead plating)
APPLICATIONS/BENEFITS
Switching and Regulating Power Supplies.
Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
Elimination of reverse-recovery oscillations
to reduce need for EMI filtering
Charge Pump Circuits
Reduces reverse recovery loss with low IRM
Small foot print
190 X 270 mils (1:1 Actual size)
See mounting pad details on pg 3
MECHANICAL & PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
POLARITY: See figure (left)
MARKING: S360
WEIGHT: 0.072 gram (approx.)
Package dimension on last page
Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
WWW
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Microsemi
Copyright
2005
5-19-05 Rev A
Page 1
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