参数资料
型号: MAX1030BETI+T
厂商: Maxim Integrated Products
文件页数: 12/22页
文件大小: 0K
描述: IC ADC 10BIT 300KSPS 28-TQFN-EP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
位数: 10
采样率(每秒): 300k
数据接口: MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 1.67W
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-WFQFN 裸露焊盘
供应商设备封装: 28-TQFN-EP(5x5)
包装: 带卷 (TR)
输入数目和类型: 16 个单端,单极;16 个单端,双极;8 个差分,单极;8 个差分,双极
MAX1026/MAX1028/MAX1030
10-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +5V ±5%, fSAMPLE = 300kHz, fSCLK = 4.8MHz (50% duty cycle), VREF = 4.096V, TA = TMIN to TMAX, unless otherwise noted.
Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)
AIN0–AIN13, REF-/AIN_,
CNVST/AIN_,
REF+ to GND.........................................-0.3V to (VDD + 0.3V)
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
20-Pin QSOP (derate 9.1mW/°C above +70°C)...........727mW
24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW
28-Pin TQFN 5mm x 5mm
(derate 20.8mW/°C above +70°C) ..........................1667mW
Operating Temperature Ranges
MAX10__C__.......................................................0°C to +70°C
MAX10__E__ ....................................................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 1)
Resolution
RES
10
Bits
Integral Nonlinearity
INL
±1.0
LSB
Differential Nonlinearity
DNL
No missing codes over temperature
±1.0
LSB
Offset Error
±0.5
±2.0
LSB
Gain Error
(Note 2)
±0.5
±2.0
LSB
Offset Error Temperature
Coefficient
±2
ppm/°C
FSR
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
DYNAMIC SPECIFICATIONS (30kHz sine wave input, 4.096VP-P, 300ksps, fSCLK = 4.8MHz)
Signal-to-Noise Plus Distortion
SINAD
61
dB
Total Harmonic Distortion
THD
Up to the 5th harmonic
-88
dBc
Spurious-Free Dynamic Range
SFDR
89
dBc
Intermodulation Distortion
IMD
fIN1 = 29.9kHz, fIN2 = 30.2kHz
76
dBc
Full-Power Bandwidth
-3dB point
1
MHz
Full-Linear Bandwidth
S/(N + D) > 68dB
100
kHz
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