MAX11043
4-Channel, 16-Bit, Simultaneous-Sampling ADCs
with PGA, Filter, and 8-/12-Bit Dual-Stage DAC
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = +3.0V to +3.6V, VDVDD = +3.0V, CDVREG = 10F, VAGND = VDGND = 0V, common-mode input voltage = VAVDD/2, VREFBP
= VREFA = VREFB = VREFC = VREFD = +2.5V (external reference), VREFDAC = VREFDACH = +1.25V (external reference), VREFDACL =
0V, CREFBP = CREFA = CREFB = CREFC = CREFD = CREFDAC = 1F, fSCLK = 38.4MHz, fEXCLK = 38.4MHz (external clock applied to
OSCIN), clock divider set to 4, SHDN = DACSTEP = UP/DWN = DGND, CONVRUN = DVDD, all analog inputs driven directly through
a series 150
/330pF anti-alias filter, PGA gain = 1. Default filters and gain settings. DIFF = 1. TA = TMIN to TMAX, unless otherwise noted
(Note 1). Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ....................................................-0.3V to +4.0V
DVDD to DGND .....................................................-0.3V to +4.0V
DVREG to DGND...................................................-0.3V to +3.0V
AGND to DGND.....................................................-0.3V to +0.3V
Analog I/O, REFDACH, REFDACL, REFA, REFB, REFC, REFD,
AOUT, REFDAC, REFBP to AGND .....-0.3V to (VAVDD + 0.3V)
UP/DWN, CONVRUN, SHDN, DACSTEP, EOC, Digital I/O,
OSCIN, OSCOUT to DGND....................-0.3V to (VDVDD + 0.3V)
Maximum Current into Any Pin except AVDD, DVDD, DVREG,
AGND, DGND...............................................................±50mA
Continuous Power Dissipation (TA = +70°C)
TQFN Multilayer Board
(derate 37mW/°C above +70°C) ................................2963mW
TQFN Single-Layer Board
(derate 26.3mW/°C above +70°C) ..........................2105.3mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SIGMA-DELTA ADC
Resolution
N
16
Bits
Integral Nonlinearity
INL
-16
±2
LSB
Differential Nonlinearity
DNL
Guaranteed monotonic
-1
+1
LSB
Offset Error
OE
-35
+35
mV
Offset-Error Drift
±30
V/°C
Gain Error
GE
Trimmed with 150
/330pF anti-alias filter
-1
+1
%
Gain Temperature Coefficient
±50
ppm/°C
Channel Gain-Error Matching
Complete analog signal path
-0.25
+0.25
%
Channel Offset Matching
Complete analog signal path
-60
+60
mV
DYNAMIC PERFORMANCE (PGA Disabled, PGA Gain = 1 x (25kHz -1dB Full-Scale Signal))
Maximum Full-Scale Input
ADC modulator gain = 1
1.2
VP-P
Input-Referred Noise Spectral
Density
100kHz
85
nV/√Hz
Second Harmonic to
Fundamental
-80
-93
dB
Third Harmonic to Fundamental
-80
-110
dB
Spurious-Free Dynamic Range
SFDR
77
93
dB
Channel-to-Channel Isolation
Unused channels are shorted and
unconnected
85
108
dB
Channel Phase Matching
Between all channels, including complete
analog signal path
-0.05
+0.05
Degrees