参数资料
型号: MAX11059ECB+T
厂商: Maxim Integrated Products
文件页数: 12/25页
文件大小: 0K
描述: IC ADC 14BIT PAR 250KSPS 64TQFP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 750
位数: 14
采样率(每秒): 250k
数据接口: 并联
转换器数目: 8
功率耗散(最大): 3.48W
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-TQFP 裸露焊盘
供应商设备封装: 64-TQFP-EP(10x10)
包装: 带卷 (TR)
输入数目和类型: 8 个单端,单极
MAX11047–MAX11049/MAX11057–MAX11059
4-/6-/8-Channel, 16-/14-Bit,
Simultaneous-Sampling ADCs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = 4.75V to 5.25V, VDVDD = +2.7V to 5.25V, VAGNDS = VAGND = VDGND = 0V, VREFIO = internal reference, CRDC = 4 x 33F,
CREFIO = 0.1F, CAVDD = 4 x 0.1F || 10F, CDVDD = 3 x 0.1F || 10F; all digital inputs at DVDD or DGND, unless otherwise noted.
TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................-0.3V to +6V
DVDD to AGND and DGND .....................................-0.3V to +6V
DGND to AGND.....................................................-0.3V to +0.3V
AGNDS to AGND...................................................-0.3V to +0.3V
CH0–CH7 to AGND ...............................................-2.5V to +7.5V
REFIO, RDC to AGND ..................................-0.3V to the lower of
(AVDD + 0.3V) and +6V
EOC, WR, RD, CS, CONVST to AGND.........-0.3V to the lower of
(DVDD + 0.3V) and +6V
DB0–DB15 to AGND ....................................-0.3V to the lower of
(DVDD + 0.3V) and +6V
Maximum Current into Any Pin Except AVDD, DVDD, AGND,
DGND ...........................................................................±50mA
Continuous Power Dissipation (TA = +70°C)
56-Pin TQFN (derated 47.6mW/°C above +70°C) ..3809.5mW
64-Pin TQFP (derate 43.5mW/°C above +70°C .........3478mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE (Note 1)
MAX11047/MAX11048/MAX11049
16
Resolution
N
MAX11057/MAX11058/MAX11059
14
Bits
MAX11047/MAX11048/MAX11049
-2
±0.65
+2
Integral Nonlinearity
INL
MAX11057/MAX11058/MAX11059
-0.9
±0.2
+0.9
LSB
MAX11047/MAX11048/MAX11049
> -1
±0.7
< +1.2
Differential Nonlinearity
DNL
MAX11057/MAX11058/MAX11059
-0.6
±0.2
+0.7
LSB
MAX11047/MAX11048/MAX11049
16
No Missing Codes
MAX11057/MAX11058/MAX11059
14
Bits
Offset Error
±0.001
±0.012
%FSR
Offset Temperature Coefficient
±0.8
V/°C
Channel Offset Matching
±0.01
%FSR
Gain Error
±0.012
%FSR
Positive Full-Scale Error
±0.017
%FSR
Positive Full-Scale Error Matching
±0.01
%FSR
Channel Gain-Error Matching
Between all channels
±0.01
%FSR
Gain Temperature Coefficient
±0.6
ppm/°C
DYNAMIC PERFORMANCE
MAX11047/MAX11048/MAX11049,
fIN = 10kHz, full-scale input
90.7
92.3
Signal-to-Noise Ratio
SNR
MAX11057/MAX11058/MAX11059,
fIN = 10kHz, full-scale input
84.5
85.3
dB
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