参数资料
| 型号： | MAX1110EAP+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | IC ADC 8BIT LP 20-SSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,000 |
| 位数： | 8 |
| 采样率（每秒）： | 50k |
| 数据接口： | MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 889mW |
| 电压电源： | 单电源 |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 20-SSOP |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 4 个单端，单极；2 个差分，双极 |
Applications Information
Power-On Reset
When power is first applied, and if SHDN is not pulled
low, internal power-on reset circuitry activates the
MAX1110/MAX1111 in internal clock mode. SSTRB is
high on power-up and, if CS is low, the first logical 1 on
DIN is interpreted as a start bit. Until a conversion takes
place, DOUT shifts out zeros. No conversions should
be performed until the reference voltage has stabilized
(see
Electrical Characteristics).
Power-Down
When operating at speeds below the maximum sam-
pling rate, the MAX1110/MAX1111’s automatic power-
down mode can save considerable power by placing
the converters in a low-current shutdown state between
conversions. Figure 13 shows the average supply cur-
rent as a function of the sampling rate.
Select power-down with PD1 of the DIN control byte
with SHDN high or high impedance (Table 3). Pull
SHDN low at any time to shut down the converters com-
pletely. SHDN overrides PD1 of the control byte.
Figures 14a and 14b illustrate the various power-down
sequences in both external and internal clock modes.
Software Power-Down
Software power-down is activated using bit PD1 of the
control byte. When software power-down is asserted, the
ADCs continue to operate in the last specified clock
mode until the conversion is complete. The ADCs then
power down into a low quiescent-current state. In internal
clock mode, the interface remains active, and conversion
results can be clocked out after the MAX1110/
MAX1111 have entered a software power-down.
The first logical 1 on DIN is interpreted as a start bit,
which powers up the MAX1110/MAX1111. If the DIN byte
contains PD1 = 1, then the chip remains powered up. If
PD1 = 0, power-down resumes after one conversion.
Hard-Wired Power-Down
Pulling SHDN low places the converters in hard-wired
power-down. Unlike software power-down, the conversion
is not completed; it stops coincidentally with SHDN being
brought low. SHDN also controls the state of the internal
reference (Table 5). Letting SHDN high impedance
enables the internal 2.048V voltage reference. When
returning to normal operation with SHDN high impedance,
there is a tRC delay of approximately 1MΩ x CLOAD,
where CLOAD is the capacitive loading on the SHDN pin.
Pulling SHDN high disables the internal reference, which
saves power when using an external reference.
External Reference
An external reference between 1V and VDD should be
connected directly at the REFIN terminal. The DC input
impedance at REFIN is extremely high, consisting of
leakage current only (typically 10nA). During a conver-
sion, the reference must be able to deliver up to 20A
average load current and have an output impedance of
1kΩ or less at the conversion clock frequency. If the
reference has higher output impedance or is noisy,
bypass it close to the REFIN pin with a 0.1F capacitor.
If an external reference is used with the MAX1110/
MAX1111, connect SHDN to VDD to disable the internal
reference and decrease power consumption.
MAX1110/MAX1111
+2.7V, Low-Power, Multichannel,
Serial 8-Bit ADCs
16
______________________________________________________________________________________
Table 5. Hard-Wired Power-Down and
Internal Reference State
SHDN
STATE
DEVICE
MODE
1
Enabled
High Impedance
Enabled
0
Power-Down
INTERNAL
REFERENCE
Disabled
Enabled
1000
1
010
30
50
10
100
MAX1110-fig13
SAMPLING RATE (ksps)
SUPPLY
CURRENT
(μ
A)
20
40
VDD = VREFIN = 3V
CLOAD AT DOUT AND SSTRB
CLOAD = 30pF
CODE = 11111111
CLOAD = 30pF
CODE = 10101010
CLOAD = 60pF
CODE = 10101010
Figure 13. Average Supply Current vs. Sampling Rate
相关PDF资料 |
PDF描述 |
|---|---|
| HIN202EIBZ-T | IC 2DRVR/2RCVR RS232 5V 16-SOIC |
| IDT72V273L6PF8 | IC FIFO 16384X18 6NS 80QFP |
| MS3106F18-8S | CONN PLUG 8POS STRAIGHT W/SCKT |
| DS34C87TMX/NOPB | IC LINE DRIVER QUAD CMOS 16-SOIC |
| IDT723641L20PQF | IC FIFO SYNC 1024X36 132-PQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX1110EPP | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX1110EPP+ | 功能描述:模数转换器 - ADC 2.7V Low-Power Multi Ch Serial 8-Bit RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX1110EVKIT | 功能描述:数据转换 IC 开发工具 MAX1110 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| MAX1110EVL11-DIP | 功能描述:数据转换 IC 开发工具 MAX1110L11-Dip Eval RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| MAX1110MJP | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
发布紧急采购，3分钟左右您将得到回复。