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参数资料
| 型号： | MAX1184ECM+D |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 9/21页 |
| 文件大小： | 0K |
| 描述： | IC ADC 10BIT 20MSPS DUAL 48-TQFP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 250 |
| 位数： | 10 |
| 采样率（每秒）： | 20M |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 功率耗散（最大）： | 150mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-TQFP 裸露焊盘 |
| 供应商设备封装： | 48-TQFP 裸露焊盘（7x7） |
| 包装： | 托盘 |
| 输入数目和类型： | 4 个单端，双极；2 个差分，双极 |
| 产品目录页面： | 1396 (CN2011-ZH PDF) |
MAX1184
Dual 10-Bit, 20Msps, 3V, Low-Power ADC with
Internal Reference and Parallel Outputs
______________________________________________________________________________________
17
Typical QAM Demodulation Application
The most frequently used modulation technique for digi-
tal communications applications is probably the quadra-
ture amplitude modulation (QAM). Typically found in
spread-spectrum-based systems, a QAM signal repre-
sents a carrier frequency modulated in both amplitude
and phase. At the transmitter, modulating the baseband
signal with quadrature outputs, a local oscillator followed
by subsequent up-conversion can generate the QAM
signal. The result is an in-phase (I) and a quadrature (Q)
carrier component, where the Q component is 90 degree
phase-shifted with respect to the in-phase component. At
the receiver, the QAM signal is divided down into it’s I
and Q components, essentially representing the modula-
tion process reversed. Figure 8 displays the demodula-
tion process performed in the analog domain, using the
dual matched 3V, 10-bit ADC (MAX1184), and the
MAX2451 quadrature demodulator to recover and digi-
tize the I and Q baseband signals. Before being digitized
by the MAX1184, the mixed down-signal components
may be filtered by matched analog filters, such as
Nyquist or pulse-shaping filters, which remove any
unwanted images from the mixing process, thereby
enhancing the overall signal-to-noise (SNR) performance
and minimizing intersymbol interference.
Grounding, Bypassing, and
Board Layout
The MAX1184 requires high-speed board layout design
techniques. Locate all bypass capacitors as close to the
device as possible, preferably on the same side as the
ADC, using surface-mount devices for minimum induc-
tance. Bypass VDD, REFP, REFN, and COM with two
parallel 0.1F ceramic capacitors and a 2.2F bipolar
capacitor to GND. Follow the same rules to bypass the
digital supply (OVDD) to OGND. Multilayer boards with
separated ground and power planes produce the high-
est level of signal integrity. Consider the use of a split
ground plane arranged to match the physical location of
the analog ground (GND) and the digital output driver
ground (OGND) on the ADC’s package. The two ground
planes should be joined at a single point such that the
noisy digital ground currents do not interfere with the
analog ground plane. The ideal location of this connec-
tion can be determined experimentally at a point along
the gap between the two ground planes, which pro-
duces optimum results. Make this connection with a low-
value, surface-mount resistor (1
to 5), a ferrite bead,
or a direct short. Alternatively, all ground pins could
share the same ground plane, if the ground plane is suf-
ficiently isolated from any noisy, digital systems ground
plane (e.g., downstream output buffer or DSP ground
plane). Route high-speed digital signal traces away
from the sensitive analog traces of either channel. Make
sure to isolate the analog input lines to each respective
converter to minimize channel-to-channel crosstalk.
Keep all signal lines short and free of 90 degree turns.
Static Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. This straight
line can be either a best straight-line fit or a line drawn
between the endpoints of the transfer function, once
offset and gain errors have been nullified. The static lin-
earity parameters for the MAX1184 are measured using
the best straight-line fit method.
0
°
90
°
÷8
DOWNCONVERTER
MAX2451
INA+
MAX1184
INA-
INB+
INB-
DSP
POST
PROCESSING
Figure 8. Typical QAM Application, Using the MAX1184
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX1184ECM-T | 制造商:Maxim Integrated Products 功能描述:DUAL 10-BIT, 20MSPS, +3V, LOW-POWER ADC WITH - Tape and Reel |
| MAX1184ECM-TD | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX11850ETM+ | 功能描述:触摸屏转换器和控制器 RoHS:否 制造商:Microchip Technology 类型:Resistive Touch Controllers 输入类型:3 Key 数据速率:140 SPS 分辨率:10 bit 接口类型:4-Wire, 5-Wire, 8-Wire, I2C, SPI 电源电压:2.5 V to 5.25 V 电源电流:17 mA 工作温度:- 40 C to + 85 C 封装 / 箱体:SSOP-20 |
| MAX11850ETM+T | 功能描述:触摸屏转换器和控制器 RoHS:否 制造商:Microchip Technology 类型:Resistive Touch Controllers 输入类型:3 Key 数据速率:140 SPS 分辨率:10 bit 接口类型:4-Wire, 5-Wire, 8-Wire, I2C, SPI 电源电压:2.5 V to 5.25 V 电源电流:17 mA 工作温度:- 40 C to + 85 C 封装 / 箱体:SSOP-20 |
| MAX11850GTM+ | 功能描述:触摸屏转换器和控制器 RoHS:否 制造商:Microchip Technology 类型:Resistive Touch Controllers 输入类型:3 Key 数据速率:140 SPS 分辨率:10 bit 接口类型:4-Wire, 5-Wire, 8-Wire, I2C, SPI 电源电压:2.5 V to 5.25 V 电源电流:17 mA 工作温度:- 40 C to + 85 C 封装 / 箱体:SSOP-20 |
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