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参数资料
| 型号： | MAX1198ECM+D |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 10/22页 |
| 文件大小： | 0K |
| 描述： | IC ADC 8BIT 100MSPS DUAL 48-TQFP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 250 |
| 位数： | 8 |
| 采样率（每秒）： | 100M |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 功率耗散（最大）： | 314mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-TQFP 裸露焊盘 |
| 供应商设备封装： | 48-TQFP 裸露焊盘（7x7） |
| 包装： | 托盘 |
| 输入数目和类型： | 4 个单端，双极；2 个差分，双极 |
| 产品目录页面： | 1396 (CN2011-ZH PDF) |
MAX1198
shifted with respect to the in-phase component. At the
receiver, the QAM signal is divided down into its I and
Q components, essentially representing the modulation
process reversed. Figure 10 displays the demodulation
process performed in the analog domain, using the
dual matched 3.3V, 8-bit ADC MAX1198 and the
MAX2451 quadrature demodulator to recover and
digitize the I and Q baseband signals. Before being
digitized by the MAX1198, the mixed down-signal com-
ponents may be filtered by matched analog filters, such
as Nyquist or pulse-shaping filters, which remove
unwanted images from the mixing process, thereby
enhancing the overall signal-to-noise (SNR) perfor-
mance and minimizing intersymbol interference.
Grounding, Bypassing,
and Board Layout
The MAX1198 requires high-speed board layout design
techniques. Locate all bypass capacitors as close to
the device as possible, preferably on the same side as
the ADC, using surface-mount devices for minimum
inductance. Bypass VDD, REFP, REFN, and COM with
two parallel 0.1F ceramic capacitors and a 2.2F
bipolar capacitor to GND. Follow the same rules to
bypass the digital supply (OVDD) to OGND. Multilayer
boards with separated ground and power planes
produce the highest level of signal integrity. Consider
the use of a split ground plane arranged to match the
Dual, 8-Bit, 100Msps, 3.3V, Low-Power ADC
with Internal Reference and Parallel Outputs
18
______________________________________________________________________________________
1/4 MAX4252
MAX6066
1/4 MAX4252
1.47k
21.5k
21.5k
21.5k
21.5k
21.5k
47
3.3V
11
2
3
4
1
REFOUT
REFP
REFIN
1
F
10
F
6V
MAX1198
N = 1
REFN
29
N.C.
31
32
1
2
29
31
32
1
2
COM
REFOUT
NOTE: ONE FRONT-END REFERENCE CIRCUIT DESIGN MAY BE USED WITH UP TO 32 ADCs.
REFP
REFIN
MAX1198
N = 32
REFN
COM
2.0V AT 8mA
3
0.1
F
0.1
F
MAX4254 POWER-SUPPLY
BYPASSING. PLACE CAPACITOR
AS CLOSE AS POSSIBLE TO
THE OP AMP.
3.3V
1.47k
47
3.3V
1.5V
11
6
5
4
7
10
F
6V
1.5V AT 0mA
1.47k
47
3.3V
11
9
10
4
8
10
F
6V
0.1
F
0.1
F
0.1
F
0.1
F
0.1
F
2.2
F
10V
0.1
F
0.1
F
1.0V AT -8mA
330
F
6V
330
F
6V
330
F
6V
2.0V
1.0V
Figure 9. External Unbuffered Reference Drive with MAX4252 and MAX6066
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相关代理商/技术参数 |
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| MAX1198ECM-TD | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX1198EVKIT | 功能描述:数据转换 IC 开发工具 RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| MAX11G | 制造商:Aavid Thermalloy 功能描述:METALIC HEAT SINK CLIP |
| MAX11NG | 功能描述:散热片 MaxClip TO220/Max220 9lb 24.7x12mm RoHS:否 制造商:Ampro By ADLINK 产品:Heat Sink Accessories 安装风格:Through Hole 散热片材料: 散热片样式: 热阻: 长度: 宽度: 高度: 设计目的:Express-HRR |
| MAX12 | 制造商:Aavid Thermalloy 功能描述:CBL ACC LOW FORCE CLIP - Bulk 制造商:Lanzar 功能描述:4Ohm 1000W Peak 12 Paper Cone Woofer 制造商:LANZAR 功能描述:12 PAPER CONE WOOFER 4OHM 1000W PEAK 制造商:Aavid Thermalloy 功能描述:Thrml Mgmt Access Heat Sink Clip |
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