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参数资料
| 型号： | MAX1239MEEE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/22页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT SERIAL 16-QSOP |
| 标准包装： | 2,500 |
| 位数： | 12 |
| 采样率（每秒）： | 94.4k |
| 数据接口： | I²C，串行 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 666.7mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-QSOP |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 12 个单端，单极；12 个单端，双极；6 个差分，单极；6 个差分，双极 |
MAX1236–MAX1239
2.7V to 3.6V and 4.5V to 5.5V, Low-Power,
4-/12-Channel, 2-Wire Serial, 12-Bit ADCs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX1237/MAX1239), VDD = 4.5V to 5.5V (MAX1236/MAX1238), VREF = 2.048V (MAX1237/MAX1239), VREF =
4.096V (MAX1236/MAX1238), fSCL = 1.7MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C, see
Tables 1–5 for programming notation.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
AIN0–AIN11,
REF to GND ............-0.3V to the lower of (VDD + 0.3V) and 6V
SDA, SCL to GND.....................................................-0.3V to +6V
Maximum Current Into Any Pin .........................................±50mA
Continuous Power Dissipation (TA = +70°C)
8-Pin MAX (derate 5.9mW/°C above +70°C) ..........470.6mW
16-Pin QSOP (derate 8.3mW/°C above +70°C)........666.7mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 1)
Resolution
12
Bits
Relative Accuracy
INL
(Note 2)
±1
LSB
Differential Nonlinearity
DNL
No missing codes over temperature
±1
LSB
Offset Error
±4
LSB
Offset-Error Temperature
Coefficient
Relative to FSR
0.3
ppm/
°C
Gain Error
(Note 3)
±4
LSB
Gain-Temperature Coefficient
Relative to FSR
0.3
ppm/
°C
Channel-to-Channel Offset
Matching
±0.1
LSB
Channel-to-Channel Gain
Matching
±0.1
LSB
DYNAMIC PERFORMANCE (fIN(SINE-WAVE) = 10kHz, VIN(P-P) = VREF, fSAMPLE = 94.4ksps)
Signal-to-Noise Plus Distortion
SINAD
70
dB
Total Harmonic Distortion
THD
Up to the 5th harmonic
-78
dB
Spurious-Free Dynamic Range
SFDR
78
dB
Full-Power Bandwidth
SINAD > 68dB
3
MHz
Full-Linear Bandwidth
-3dB point
5
MHz
CONVERSION RATE
Internal clock
7.5
Conversion Time (Note 4)
tCONV
External clock
10.6
s
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