参数资料
型号: MAX1275BETC+T
厂商: Maxim Integrated Products
文件页数: 11/18页
文件大小: 0K
描述: IC ADC 12BIT 1.8MSPS 12-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
位数: 12
采样率(每秒): 1.8M
数据接口: MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 45mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 12-WQFN 裸露焊盘
供应商设备封装: 12-TQFN-EP(4x4)
包装: 带卷 (TR)
输入数目和类型: 1 个差分,双极
MAX1274/MAX1275
1.8Msps, Single-Supply, Low-Power,
True-Differential, 12-Bit ADCs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +5V ±5%, VL = VDD, VREF = 4.096V, fSCLK = 28.8MHz, 50% duty cycle, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
VL to GND ...................-0.3V to the lower of (VDD + 0.3V) or +6V
Digital Inputs
to GND ....................-0.3V to the lower of (VDD + 0.3V) or +6V
Digital Output
to GND .......................-0.3V to the lower of (VL + 0.3V) or +6V
Analog Inputs and
REF to GND.............-0.3V to the lower of (VDD + 0.3V) or +6V
RGND to GND .......................................................-0.3V to +0.3V
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
12-Pin TQFN (derate 16.9mW/°C above +70°C) ......1349mW
Operating Temperature Range
MAX127_ ETC.................................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
12
Bits
MAX127_A
-1.0
+1.0
Relative Accuracy
INL
(Note 1)
MAX127_B
-1.75
+1.75
LSB
MAX127_A
-1.0
+1.0
Differential Nonlinearity
DNL
(Note 2)
MAX127_B
-1.0
+1.75
LSB
Offset Error
±6.0
LSB
Offset-Error Temperature
Coefficient
±1
ppm/°C
Gain Error
Offset nulled
±6.0
LSB
Gain Temperature Coefficient
±2
ppm/°C
DYNAMIC SPECIFICATIONS (fIN = 525kHz sine wave, VIN = VREF, unless otherwise noted.)
MAX127_A
69
70
Signal-to-Noise Plus Distortion
SINAD
MAX127_B
67
70
dB
Total Harmonic Distortion
(Up to the 5th Harmonic)
THD
-80
-76
dB
Spurious-Free Dynamic Range
SFDR
-83
-76
dB
Intermodulation Distortion
IMD
fIN1 = 250kHz, fIN2 = 300kHz
-78
dB
Full-Power Bandwidth
-3dB point, small-signal method
20
MHz
Full-Linear Bandwidth
S/(N + D) > 68dB, single ended
1.2
MHz
CONVERSION RATE
Minimum Conversion Time
tCONV
(Note 3)
0.556
s
Maximum Throughput Rate
1.8
Msps
Minimum Throughput Rate
(Note 4)
10
ksps
Track-and-Hold Acquisition Time
tACQ
(Note 5)
104
ns
Aperture Delay
5ns
Aperture Jitter
(Note 6)
30
ps
External Clock Frequency
fSCLK
28.8
MHz
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