参数资料
型号: MAX1444EHJ+T
厂商: Maxim Integrated Products
文件页数: 12/20页
文件大小: 0K
描述: IC ADC 10BIT 40MSPS 32-TQFP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
位数: 10
采样率(每秒): 40M
数据接口: 并联
转换器数目: 1
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-TQFP
供应商设备封装: 32-TQFP(5x5)
包装: 带卷 (TR)
输入数目和类型: 2 个单端,双极;1 个差分,双极
MAX1444
10-Bit, 40Msps, 3.0V, Low-Power
ADC with Internal Reference
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 3V; OVDD = 2.7V; 0.1F and 1F capacitors from REFP, REFN, and COM to GND; VREFIN = 2.048V; REFOUT connected to
REFIN through a 10k
Ω resistor; VIN = 2VP-P (differential with respect to COM); CL = 10pF at digital outputs; fCLK = 40MHz; TA = TMIN
to TMAX, unless otherwise noted. ≥ +25°C guaranteed by production test, < +25°C guaranteed by design and characterization; typi-
cal values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD, OVDD to GND ...............................................-0.3V to +3.6V
OGND to GND.......................................................-0.3V to +0.3V
IN+, IN- to GND........................................................-0.3V to VDD
REFIN, REFOUT, REFP,
REFN, and COM to GND........................-0.3V to (VDD + 0.3V)
OE, PD, CLK to GND..................................-0.3V to (VDD + 0.3V)
D9–D0 to GND.........................................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
32-Pin TQFP (derate 18.7mW/°C above +70°C).....1495.3mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
10
Bits
Integral Nonlinearity
INL
fIN = 7.51MHz, TA
≥ +25°C
±0.6
±1.9
LSB
Differential Nonlinearity
DNL
fIN = 7.51MHz, no missing codes
guaranteed
±0.4
±1.0
LSB
Offset Error
<
±0.1
±1.7
% FS
Gain Error
TA
≥ +25°C
0
±2% FS
ANALOG INPUT
Input Differential Range
VDIFF
Differential or single-ended inputs
±1.0
V
Common-Mode
Voltage Range
VCOM
VDD/2
±0.5
V
Input Resistance
RIN
Switched capacitor load
50
k
Ω
Input Capacitance
CIN
5pF
CONVERSION RATE
Maximum Clock Frequency
fCLK
40
MHz
Data Latency
5.5
Cycles
DYNAMIC CHARACTERISTICS (fCLK = 40MHz, 4096-point FFT)
fIN = 7.51MHz
57.5
59.5
fIN = 19.91MHz
56.3
59.5
Signal-to-Noise Ratio
SNR
fIN = 39.9MHz (Note 1)
58.5
dB
fIN = 7.51MHz
57
59.4
fIN = 19.91MHz
56.1
59
Signal-to-Noise + Distortion
(Up to 5th harmonic)
SINAD
fIN = 39.9MHz (Note 1)
58.3
dB
fIN = 7.51MHz
67
75
fIN = 19.91MHz
66
74
Spurious-Free Dynamic Range
SFDR
fIN = 39.9 MHz (Note 1)
72.5
dBc
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