参数资料
型号: MAX14502AETL+
厂商: Maxim Integrated Products
文件页数: 3/41页
文件大小: 0K
描述: IC CARD READER USB-SD 40-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 60
应用: USB
接口: I²C,2 线串口
电源电压: 1.8 V ~ 3.3 V
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-TQFN-EP(5x5)
包装: 管件
安装类型: 表面贴装
MAX14500–MAX14503
Hi-Speed USB-to-SD Card
Readers with Bypass
______________________________________________________________________________________
11
Pin Description (continued)
PIN
TQFN
WLP
NAME
FUNCTION
C5
HDAT2_2
SD Card 2 Data Bus Analog Switch. HDAT2_2 connects to DAT2 on the SD port of
the host P.
A4
HDAT2_3
SD Card 2 Data Bus Analog Switch. HDAT2_3 connects to DAT3 on the SD port of
the host P.
G4
HCMD2
SD Card 2 Command Analog Switch. HCMD2 connects to CMD on the SD port of the
host P.
G3
HCLK2
SD Card 2 Clock Analog Switch. HCLK2 connects to CLK on the SD port of the host P.
POWER SUPPLY
5A6
VIO
I/O Logic-Level Translator Voltage. Bypass VIO to GND with a 0.1F ceramic
capacitor. VIO powers the logic inputs/outputs and I2C block.
23
F6
VTM
USB Analog Switch and Transceiver Power Supply. Bypass VTM to GND with a 0.1F
ceramic capacitor.
38
B1, B2
CLDO
Bypass Capacitor for Internal +1.8V LDO. Connect a 1F ceramic capacitor (X7R,
X5R, or better) from CLDO to GND. CLDO must not be used to power external
circuitry.
39
B3, C3
VCC
Digital Supply Voltage. Bypass VCC to GND with a 1F ceramic capacitor (X7R, X5R,
or better).
40
A1
VSD
SD Card Voltage. Bypass VSD to GND with a 1F ceramic capacitor (X7R, X5R, or
better).
18, 24, 26,
37
C1, C2, E7,
E8, G5, G6
GND
Ground
NO CONNECTION
35, 36
D4, E4
N.C.
No Connection. Connect N.C. to GND.
EXPOSED PAD
EP
Exposed Pad. Connect EP to GND. Do not use EP as the sole GND connection.
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