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参数资料
| 型号： | MAX14539EEVB+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 6/13页 |
| 文件大小： | 0K |
| 描述： | IC MUX SWITCH DPDT ESD 10-UTQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 开关 |
| 电路： | 1 x DPDT |
| 导通状态电阻： | 350 毫欧 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 2.4 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-UFQFN |
| 供应商设备封装： | 10-UTQFN（1.4x1.8） |
| 包装： | 带卷 (TR) |
MAX14535E–MAX14539E
Low-Resistance DPDT Switches
with Negative Rail
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +2.4V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.0V, TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7 using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic/thermal-tutorial.
(Voltages referenced to GND.)
VCC, CB, EN ..........................................................-0.3V to +6.0V
NO_, NC_, COM_ (VCC > 2.4V, MAX14535E/
MAX14536E/MAX14539E).................................-1.8V to +3.6V
NO_, NC_, COM_ (VCC < 2.4V, MAX14535E/
MAX14536E/MAX14539E).................................-0.3V to +3.6V
NO_, NC_, COM_ (VEN < VIL, MAX14537E/
MAX14538E)......................................................-0.3V to +6.0V
NO_, NC_, COM_ (VEN > VIL, VCC > 2.4V,
MAX14537E/MAX14538E).................................-1.8V to +3.6V
NO_, NC_, COM_ (VEN < VIL, VCC < 2.4V,
MAX14537E/MAX14538E).................................-0.3V to +3.6V
Continuous Current into NO_, NC_, COM_ Terminals....±300mA
Peak Current into NO_, NC_,
COM_ Terminals (50% duty cycle).............................±500mA
Continuous Power Dissipation (TA = +70°C)
10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)..143.1°C/W
Junction-to-Case Thermal Resistance (
θJC) (Note 1)...20.1°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature Range ............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Range
VCC
2.4
5.5
V
MAX14537E/MAX14538E,
VEN = 0
1
VCC =
3.0V
MAX14535E/MAX14536E/
MAX14539E, VEN = 0, VEN = VCC
815
MAX14537E/MAX14538E,
VEN = 0
1
Supply Current
ICC
VCC =
5.5V
MAX14535E/MAX14536E/
MAX14539E, VEN = 0, VEN = VCC
12
25
A
Supply Current Increase with
Logic Level
VEN = 0.4V or 1.4V, VCB = 0.4V or 1.4V
5
A
MAX14537E/MAX14538E,
VEN < VIL
0VCC
MAX14537E/MAX14538E,
VEN > VIH
-1.5
Min
(3.0V,
VCC)
Analog Signal Range
MAX14535E/MAX14536E/MAX14539E
-1.5
Min
(3.0V,
VCC)
V
On-Resistance
RON
VCC = 3.0V, VCOM_ = -1.5V, 3.0V;
INO_ = 100mA or INC_ = 100mA
0.135
0.35
On-Resistance Match Between
Channels
RON
VCC = 3.0V, VCOM_ = 0; ICOM_ = 100mA
(Note 3)
0.05
On-Resistance Flatness
RFLAT(ON)
VCC = 3.0V, ICOM_ = 100mA;
VCOM_ = -1.5V to +3.0V (Note 4)
0.3
1
m
Shunt Switch Resistance
RSH
INO_ or INC_ = 1mA
500
1000
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