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参数资料
| 型号： | MAX14566AEETA+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/15页 |
| 文件大小： | 0K |
| 描述： | IC USB SWITCH HOST CHARGER 8TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | USB 开关 |
| 电路： | 1 x SPST |
| 导通状态电阻： | 6.5 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 2.8 V ~ 5.5 V |
| 电流 - 电源： | 120µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 供应商设备封装： | 8-TDFN-EP（2x2） |
| 包装： | 带卷 (TR) |
MAX14566E/MAX14566AE/MAX14566BE
USB Host Charger Identification
Analog Switches
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC, TDP, TDM, CB, DP, DM, CEN/CEN, CB1....-0.3V to +6.0V
Continuous Current into any Terminal............................. Q30mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 11.9mW/NC above +70NC) ....................954mW
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VCC = 2.8V to 5.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 5.0V, TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (
qJA)...........84°C/W
Junction-to-Case Thermal Resistance (
qJC)................37°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY (MAX14566E/MAX14566AE)
Power-Supply Range
VCC
VCB > VIH
2.8
5.5
V
VCB = 0V (Note 3)
4.75
5.25
V
Supply Current
ICC
VCB = VCC
VCC = 3.3V
2
F
A
VCC = 5.5V
7
VCB = 0V
VCC = 4.75V
110
200
VCC = 5.25V
120
200
Supply Current Increase
D
ICC
0 P VCB P VIL or VIH P VCB P VCC
2
F
A
POWER SUPPLY (MAX14566BE)
Power-Supply Range
VCC
VCB = VCC and VCB1 = VCC or VCB = VCC
and VCB1 = 0V or VCB = 0V and
VCB1 = VCC
2.8
5.5
V
VCB = 0V and VCB1 = 0V (Note 3)
4.75
5.25
V
Supply Current
ICC
VCB = VCC and
VCB1 = VCC or
VCB = VCC and
VCB1 = 0V
VCC = 3.3V
2
mA
VCC = 5.5V
7
VCB = 0V and
VCB1 = 0V
VCC = 4.75V
110
200
VCC = 5.25V
120
200
VCB = 0V and
VCB1 = VCC
VCC = 5.0V for TYP
VCC = 5.5V for MAX
3
7
Supply Current Increase
D
ICC
VCB1 = 0V; 0 ≤ VCB ≤ VIL
and VIH ≤ VCB ≤ VCC (Note 4)
1
mA
VCB = 0V; 0 ≤ VCB1 ≤ VIL
and VIH ≤ VCB1 ≤ VCC (Note 4)
1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX14566BEETA+ | 制造商:Maxim Integrated Products 功能描述:SECOND GENERATION USB DEVICE THAT COMBINES A USB HI-SPEED AN - Rail/Tube |
| MAX14566BEETA+T | 功能描述:模拟开关 IC USB HiSpeed an swtch w/USB host chrgr IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX14566EETA+ | 制造商:Maxim Integrated Products 功能描述:2ND GEN. USB DEVICE THAT COMBINES A USB HI-SPEED ANALOG SWI - Rail/Tube |
| MAX14566EETA+T | 功能描述:模拟开关 IC USB HiSpeed an swtch w/USB host chrgr IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX14566EETA+TGH7 | 功能描述:模拟开关 IC Second generation USB device that combines a USB Hi-Speed analog switch with a USB host charger IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
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