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| 型号： | MAX14756EUE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 5/12页 |
| 文件大小： | 0K |
| 描述： | IC ANLG SWITCH SPST QUAD 16TSSOP |
| 标准包装： | 2,500 |
| 功能： | 开关 |
| 电路： | 4 x SPST - NC |
| 导通状态电阻： | 10 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 10 V ~ 70 V，±10 V ~ 35 V |
| 电流 - 电源： | 500µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 带卷 (TR) |
2 ______________________________________________________________________________________
MAX14756/MAX14757/MAX14758
Quad SPST +70V Analog Switches
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VDD to VSS ...........................................................-0.3V to +72V
VSS to GND ..........................................................-36V to +0.3V
VL, EN_ to GND ........-0.3V to the lesser of (+12V, VDD + 0.3V)
A_, B_ to VSS ..............................-0.3V to (VDD + 2V) or 100mA
(whichever occurs first)
Continuous Current into A_, B_ .................................... Q100mA
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate 11.1mW/NC above +70NC) .................889mW
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Junction Temperature ................................................... +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)...........90NC/W
Junction-to-Case Thermal Resistance (BJC)................27NC/W
ELECTRICAL CHARACTERISTICS—DUAL SUPPLIES
(VDD = +35V, VSS = -35V, VGND = 0V, VL = +3.3V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.)
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
VDD Supply-Voltage Range
VDD
+10
+35
V
VSS Supply-Voltage Range
VSS
-10
-35
V
VL Logic Supply-Voltage Range
VL
+1.6
+11
V
VDD Supply Current
IDD(OFF)
VEN_ to switch off state, VA_, VB_ = +20V
200
450
F
A
IDD(ON)
VEN_ to switch on state, VA_, VB_ = +20V
500
800
VSS Supply Current
ISS(OFF)
VEN_ to switch off state, VA_, VB_ = +20V
200
450
F
A
ISS(ON)
VEN_ to switch on state, VA_, VB_ = +20V
500
800
VL Current
IL
VL = +11V, VEN1 = VEN2 = VEN3 = VEN4 =
(0.25 x VL) or ( 0.75 x VL)
0.4
mA
SWITCH
Analog-Signal Range
VA_, VB_
Figure 1
VSS
VDD
V
Current Through Switch
IA_, IB_
VA_, VB_ = +20V
-50
+50
mA
On-Resistance
RON
IA_, IB_ = 10mA, VA_, VB_ = Q20V, Figure 1
5
10
I
On-Resistance Matching
Between Channels
D
RON
IA_, IB_ = 10mA, VA_, VB_ = Q20V, 0V
(Note 2)
0.3
0.5
I
On-Resistance Flatness
RFLAT(ON) IA_, IB_ = 10mA, VA_, VB_ = Q20V
0.004
I
On-Leakage Current
IA/B_(ON)
VB_ = Q20V, VA_= unconnected, Figure 2
-5
+5
nA
VB_ = Q20V, VA_ = unconnected,
TA = +25NC, Figure 2
0.01
Off-Leakage Current
IA/B_(OFF)
VB_ = Q20V, VA_ = -20V, Figure 3
-2.5
+2.5
nA
VB_ = Q20V, VA_ = -20V, TA = +25NC,
Figure 3
0.01
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