参数资料
型号: MAX14886CTL+
厂商: Maxim Integrated Products
文件页数: 3/10页
文件大小: 0K
描述: MUX DUAL HDMI LVL SHIFTER 40TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 60
系列: DisplayPort™
类型: 多路复用器,变换器
应用: 显示器端口,HDMI
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-TQFN-EP(5x5)
包装: 托盘
MAX14886
Dual DisplayPort Graphics Multiplexer
with HDMI Level Shifter
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
VCC.......................................................................-0.3V to +4.0V
EN1, EN2, SEL, ADJ ................................ -0.3V to (VCC + 0.3V)
D_CP, D_CN, CKCP, CKCN Short-Circuit
Output Current ............................................................. Q30mA
All Other Pins Short-Circuit Current .................................. Q5mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 35.7mW/NC above +70NC) ..................2857mW
Operating Temperature Range............................. 0NC to +70NC
Storage Temperature Range............................ -65NC to +150NC
Maximum Junction Temperature.....................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VCC = +3.3V, TA = 0NC to +70NC, RADJ = 3.3kI, CCL = 100nF, typical values are at TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (
qJA) ..........45°C/W
Junction-to-Case Thermal Resistance (
qJC) .................2°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE
Supply Voltage
VCC
3
3.6
V
Supply Current
ICC
EN1 = high, EN2 = low
52.5
mA
Total Supply Current
IGND
50I termination to AVCC, VAVCC = +3.3V
(Note 3)
105
mA
Shutdown Supply Current
ISHUT
EN1 = low or EN2 = high
100
F
A
Single-Ended Input Termination
Resistance
RIN
DC
40
60
I
Single-Ended Output Voltage
High
VOH
DC, VAVCC = +3.3V (Notes 3, 4)
VAVCC
- 0.01
VAVCC
+ 0.01
V
Single-Ended Output Voltage
Low
VOL
DC, VAVCC = +3.3V (Notes 3, 4)
VAVCC
- 0.6
VAVCC
- 0.45
V
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