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参数资料
| 型号： | MAX14979EETX+GH7 |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/10页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH LVDS HIGH BW 36TQFN |
| 标准包装： | 50 |
| 功能： | 开关 |
| 电路： | 4 x DPDT |
| 导通状态电阻： | 5.5 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 36-WFQFN 裸露焊盘 |
| 供应商设备封装： | 36-TQFN 裸露焊盘（6x6） |
| 包装： | 托盘 |
MAX14979E
High-Bandwidth, ±15kV ESD Protection
LVDS Switch
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
V+.........................................................................-0.3V to +4.0V
All Other Pins...............................................-0.3V to (V+ + 0.3V)
Continuous Current (COM_ _ to NC_ _/NO_ _) ............ Q120mA
Continuous Current (AUX0_ to AUX1_/AUX2_)............... Q40mA
Peak Current (COM_ _ to NC_ _/NO_ _)
(pulsed at 1ms, 10% duty cycle)............................... Q240mA
Current into Any Other Pin .............................................. Q20mA
Continuous Power Dissipation (TA = +70NC)
36-Pin TQFN (derate 35.7mW/NC above +70NC) .......2.85mW
Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature .................................................. +150NC
Storage Temperature Range ......................... -65NC to +150NC
Lead Temperature (soldering 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V+ = +3.0V to +3.6V, TA = TJ = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.3V, TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ............8NC/W
Junction-to-Case Thermal Resistance (BJC) .................1NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLIES
Operating Power-Supply Range
V+
+3.0
+3.6
V
ANALOG SWITCH
On-Resistance
RON
V+ = 3V, ICOM_ _ = -40mA,
VCOM_ _ = 0V, 1.5V, 3V
TA = +25NC
4
5.5
I
TMIN to TMAX
6.5
On-Resistance AUX Switches
RONAUX
V+ = 3V, IAUX0_ = -40mA, VAUX0_ = 0V,
1.5V, 3V
40
I
On-Resistance Match
Between Channels
D
RON
V+ = 3V, ICOM_ _ = -40mA,
VCOM_ _ = 0V, 3V (Note 3)
TA = +25NC
0.5
1.5
I
TMIN to TMAX
2
On-Resistance Flatness
RFLAT(ON)
V+ = 3V, ICOM_ _ = -40mA,
VCOM_ _ = 0V, 1.5V
0.01
I
Off-Leakage Current
ILCOM_
_(OFF)
V+ = 3.6V, VCOM_ _ = 0.3V, 3.3V;
VNC_ _ or VNO_ _ = 3.3V, 0.3V
-1
+1
F
A
On-Leakage Current
ILCOM_
_(ON)
V+ = 3.6V, VCOM_ _ = 0.3V, 3.3V; VNC_ _
or VNO_ _ = 3.3V, 0.3V or unconnected
-1
+1
F
A
SWITCH AC PERFORMANCE
Insertion Loss
ILOS
RS = RL = 50I, unbalanced, f = 1MHz,
(Note 3)
0.6
dB
Return Loss
RLOS
f = 100MHz
-23
dB
Crosstalk
VCT1
Any switch to any switch;
RS = RL = 50I,
unbalanced, Figure 1
f = 25MHz
-50
dB
VCT2
f = 125MHz
-26
SWITCH AC CHARACTERISTICS
-3dB Bandwidth
BW
RS = RL = 50I, unbalanced
650
MHz
Off-Capacitance
COFF
f = 1MHz, COM_ _
3.5
pF
On-Capacitance
CON
f = 1MHz, COM_ _
8
pF
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