参数资料
型号: MAX15004BAUE/V+T
厂商: Maxim Integrated Products
文件页数: 21/27页
文件大小: 0K
描述: IC REG CTRLR PWM CM 16-TSSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
PWM 型: 电流模式
输出数: 1
频率 - 最大: 1MHz
占空比: 50%
电源电压: 4.5 V ~ 40 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
包装: 标准包装
其它名称: MAX15004BAUE/V+TDKR
MAX15004A/B/MAX15005A/B
4.5V to 40V Input Automotive
Flyback/Boost/SEPIC Power-Supply Controllers
MOSFET, Diode, and Series Capacitor Selection
in a SEPIC Converter
For the SEPIC configuration, choose an n-channel
MOSFET with a V DS rating at least 20% higher than the
sum of the output and input voltages. When operating
at a high switching frequency, the gate charge and
switching losses become significant. Use low gate-
charge MOSFETs. The RMS current of the MOSFET is:
The series capacitor should be chosen for minimum rip-
ple voltage ( Δ V CP ) across the capacitor. We recommend
using a maximum ripple Δ V CP to be 5% of the minimum
input voltage (V IN-MIN ) when operating at the minimum
input voltage. The multilayer ceramic capacitor X5R and
X7R series are recommended due to their high ripple
current capability and low ESR. Use the following equa-
tion to calculate the series capacitor CP value.
? ( I LPK ) 2 + ( I LDC ) 2 + ( I LPK × I LDC ) ? × D MAX
CP = ? OUT ? MAX MAX ?
?
?
I MOS ? RMS ( A ) =
? ? 3
Δ V CP × f OUT
? I × D ?
where I LDC = (I LPK - Δ I L ).
Use Schottky diodes for higher conversion efficiency.
The reverse voltage rating of the Schottky diode must
be higher than the sum of the maximum input voltage
(V IN-MAX ) and the output voltage. Since the average
current flowing through the diode is equal to the output
current, choose the diode with forward current rating of
I OUT-MAX . The current sense (R S ) can be calculated
using the current-limit threshold (0.305V) of
MAX15004/MAX15005 and I LPK . Use a diode with a for-
ward current rating more than the maximum output cur-
rent limit if the SEPIC converter needs to be output
short-circuit protected.
where Δ V CP is 0.05 x V IN-MIN .
For a further discussion of SEPIC converters, go to
http://pdfserv.maxim-ic.com/en/an/AN1051.pdf.
Power Dissipation
The MAX15004/MAX15005 maximum power dissipation
depends on the thermal resistance from the die to the
ambient environment and the ambient temperature. The
thermal resistance depends on the device package,
PCB copper area, other thermal mass, and airflow.
Calculate the temperature rise of the die using following
equation:
T J = T C + (P T x θ JC )
or
R CS =
0 . 305
I LPK
T J = T A + (P T x θ JA )
where θ JC is the junction-to-case thermal impedance
× ( I LPK
Δ I L ) ?
I OUT ? LIM = ?
?
?
Select R CS 20% below the value calculated above.
Calculate the output current limit using the following
equation:
? D ?
?
( 1 ? D )
where D is the duty cycle at the highest input voltage
(V IN-MAX ).
Maxim Integrated
(3°C/W) of the 16-pin TSSOP-EP package and P T is
power dissipated in the device. Solder the exposed
pad of the package to a large copper area to spread
heat through the board surface, minimizing the case-to-
ambient thermal impedance. Measure the temperature
of the copper area near the device (T C ) at worst-case
condition of power dissipation and use 3°C/W as θ JC
thermal impedance. The case-to-ambient thermal
impedance ( θ JA ) is dependent on how well the heat is
transferred from the PCB to the ambient. Use a large
copper area to keep the PCB temperature low. The θ JA
is 38°C/W for TSSOP-16-EP and 90°C/W for TSSOP-16
package with the condition specified by the JEDEC51
standard for a multilayer board.
21
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