参数资料
型号: MAX15034BEVKIT+
厂商: Maxim Integrated Products
文件页数: 2/26页
文件大小: 0K
描述: KIT EVALUATION FOR MAX15034
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: DC/DC,步降
输入电压: 5 ~ 28 V
稳压器拓扑结构: 降压
板类型: 完全填充
已供物品:
已用 IC / 零件: MAX15034
Configurable, Single-/Dual-Output, Synchronous
Buck Controller for High-Current Applications
ABSOLUTE MAXIMUM RATINGS
IN, LX_ to AGND.....................................................-0.3V to +30V
BST_ to AGND........................................................-0.3V to +35V
DH_ to LX_ ....................................-0.3V to (V BST_ - V LX_ ) + 0.3V
DL_ to PGND ..............................................-0.3V to (V DD + 0.3V)
BST_ to LX_ ..............................................................-0.3V to +6V
V DD to PGND............................................................-0.3V to +6V
AGND to PGND .....................................................-0.3V to +0.3V
AVGLIMIT, REG, RT/CLKIN, CSP_,
CSN_ to AGND ......................................................-0.3V to +6V
All Other Pins to AGND ............................-0.3V to (V REG + 0.3V)
REG Continuous Output Current
(limited by power dissipation, no thermal or short-circuit
protection).........................................................................67mA
Continuous Power Dissipation (T A = +70°C) (Note 1)
28-Pin TSSOP (derate 14mW/°C above +70°C) ..........1117mW
28-Pin TSSOP-EP (derate 27mW/°C above +70°C)........2162mW
Operating Temperature Range .........................-40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance ( θ JA )..................71.6°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................13°C/W
TSSOP-EP
Junction-to-Ambient Thermal Resistance ( θ JA )..................37°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = V REG = V DD = V EN_ = +5V, T A = T J = T MIN to T MAX , unless otherwise noted, circuit of Figure 6. Typical values are at T A = +25°C.)
(Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SYSTEM SPECIFICATIONS
5
28
Input Voltage Range
Quiescent Supply Current
V IN
I IN
IN and REG shorted together for +5V
operation
f OSC = 500kHz, DH_ or DL_ = open
4.75
7
5.50
17
V
mA
STARTUP/INTERNAL REGULATOR OUTPUT (REG)
REG Undervoltage Lockout
UVLO
V REG rising
4.0
4.15
4.5
V
Hysteresis
V HYST
200
mV
REG Output Accuracy
REG Dropout
V IN = 5.8V to 28V, I SOURCE = 0 to 65mA
V IN < 5.8V, I SOURCE = 60mA
4.75
5.10
5.30
0.5
V
V
INTERNAL REFERENCE
EAN_ connected to
Internal Reference Voltage
V EAN_
EAOUT_
T A = -40°C to +125°C
0.605
0.6125
0.620
V
(Note 3)
Digital Ramp Period for Soft-Start
Soft-Start Voltage Steps
MOSFET DRIVERS
1024
64
Clock
cycles
Steps
p-Channel Output Driver
Impedance
R ON_P
1.35
3
?
2
_______________________________________________________________________________________
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