参数资料
型号: MAX15037ATE+
厂商: Maxim Integrated Products
文件页数: 21/25页
文件大小: 0K
描述: IC REG BUCK BST SYNC ADJ 16TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 60
类型: 降压(降压),升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 0.6 V ~ 23 V
输入电压: 4.5 V ~ 23 V
PWM 型: 电压模式
频率 - 开关: 312kHz ~ 2.1MHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-WQFN 裸露焊盘
包装: 管件
供应商设备封装: 16-TQFN-EP(5x5)
2.2MHz, 3A Buck or Boost Converters
with an Integrated High-Side Switch
side of the PCB. Do not make a direct connection of
the exposed pad copper plane to the SGND (pin 10)
underneath the IC. Connect this plane and SGND
together at the return terminal of the V+ bypass
capacitor
Layout Procedure
1) Place the power components (inductor, C IN , and
C OUT ) first, with ground terminals close to each
other. Make all these connections on the top layer
with wide, copper-filled areas (2oz copper recom-
2)
3)
4)
5)
Isolate the power components and high-current
paths from sensitive analog circuitry.
Keep the high-current paths short, especially at the
ground terminals. This practice is essential for sta-
ble, jitter-free operation.
Connect SGND and PGND together close to the
return terminals of the V L and V+ high-frequency
bypass capacitors near the IC. Do not connect them
together anywhere else.
Keep the power traces and load connections short.
mended).
2) Group the gate-drive components (boost diodes
and capacitors, and V L bypass capacitor) together
near the controller IC.
3) Make the ground connections as follows:
a) Create a small-signal ground plane underneath
the IC.
b) Connect this plane to SGND and use this plane
for the ground connection for BYPASS, COMP,
FB, and OSC.
This practice is essential for high efficiency. Use
thick copper PCBs to enhance full-load efficiency
and power dissipation capability.
6) Ensure that the feedback connection from FB to
C OUT is short and direct.
7) Route high-speed switching nodes (BST/VDD,
SOURCE) away from the sensitive analog areas
(BYPASS, COMP, FB, and OSC). Use internal PCB
layers for SGND as EMI shields to keep radiated
noise away from the IC, feedback dividers, and the
analog bypass capacitors.
c) Connect SGND and PGND together at the
return terminal of V+ and V L bypass capacitors
near the IC. Make this the only connection
between SGND and PGND.
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21
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MAX15037ATE/V+ 功能描述:直流/直流开关转换器 2.2MHz 3A Buck wInt High-Side Switch RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX15037ATE/V+T 功能描述:直流/直流开关转换器 2.2MHz 3A Buck wInt High-Side Switch RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX15037ATE+ 功能描述:直流/直流开关转换器 2.2MHz 3A Buck wInt High-Side Switch RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX15037ATE+T 功能描述:直流/直流开关转换器 2.2MHz 3A Buck wInt High-Side Switch RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX15038ETG+ 功能描述:直流/直流开关调节器 4A 2MHz Step-Down w/Integrated Switch RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5