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参数资料
| 型号： | MAX15046AAEE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 19/24页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 16-QSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 1.1MHz |
| 占空比： | 87.5% |
| 电源电压： | 4.5 V ~ 40 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 包装： | 带卷 (TR) |
MAX15046
40V, High-Performance, Synchronous
Buck Controller
Use a low-ESR ceramic capacitor as the boost capacitor
V OUT
C CF
with a minimum value of 100nF.
A small-signal diode can be used for the bootstrap cir-
R I
R 1
R F
C F
cuit and must have a minimum voltage rating of V IN +
3V to withstand the maximum BST voltage. The average
forward current of the diode should meet the following
C I
requirement:
I F > Q GATE x f SW
R 2
V REF
g M
COMP
where Q GATE is the gate charges of the high-side MOSFET.
Power Dissipation
The maximum power dissipation of the device depends
on the thermal resistance from the die to the ambient
Figure 4. Type III Compensation Network
overall thermal budget. Ensure that the DL gate driver
can drive the low-side MOSFET. In particular, check
that the dv/dt caused by the high-side MOSFET turning
on does not pull up the low-side MOSFET gate through
the drain-to-gate capacitance of the low-side MOSFET,
which is the most frequent cause of crossconduction
problems.
Check power dissipation when using the internal linear
regulator to power the gate drivers. Select MOSFETs
with low gate charge so that V CC can power both drivers
without overheating the device:
P DRIVE = V CC x Q G_TOTAL x f SW
where Q G_TOTAL is the sum of the gate charges of the
two external MOSFETs.
Boost Capacitor and Diode Selection
The MAX15046 uses a bootstrap circuit to generate
the necessary gate-to-source voltage to turn on the
high-side MOSFET. The selected n-channel high-side
MOSFET determines the appropriate boost capacitance
value (C BST in the Typical Application Circuits ) accord-
ing to the following equation:
environment and the ambient temperature. The thermal
resistance depends on the device package, PCB copper
area, other thermal mass, and airflow.
The power dissipated into the package (P T ) depends
on the supply configuration (see the Typical Application
Circuits ). Use the following equation to calculate power
dissipation:
P T = V IN x [Q G_TOTAL x f SW + I Q ]
where I Q is the quiescent supply current at the switching
frequency. See the I IN vs. Switching Frequency graph in
the Typical Operating Characteristics for the I Q .
Use the following equation to estimate the temperature
rise of the die:
T J = T A + (P T x B JA )
where B JA is the junction-to-ambient thermal impedance
of the package, P T is power dissipated in the device,
and T A is the ambient temperature. The B JA is 103.7 N C/W
for the 16-pin QSOP and 44 N C/W for the 16-pin QSOP-
EP package on multilayer boards, with the conditions
specified by the respective JEDEC standards (JESD51-5,
JESD51-7). An accurate estimation of the junction tem-
perature requires a direct measurement of the case
temperature (T C ) when actual operating conditions
significantly deviate from those described in the JEDEC
C BST =
Q G
? V BST
standards. The junction temperature is then:
T J = T C + (P T x B JC )
where Q G is the total gate charge of the high-side
MOSFET and D V BST is the voltage variation allowed
on the high-side MOSFET driver after turn-on. Choose
D V BST such that the available gate-drive voltage is not
significantly degraded (e.g. D V BST = 100mV to 300mV)
when determining C BST .
Maxim Integrated
Use 37 N C/W as B JC thermal impedance for the 16-pin
QSOP package and 6 N C/W for the 16-pin QSOP-EP
package. The case-to-ambient thermal impedance ( B CA )
is dependent on how well the heat is transferred from the
PCB to the ambient. Use large copper areas to keep the
PCB temperature low.
19
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX15046AEEE+ | 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX15046AEEE+T | 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX15046BAEE+ | 功能描述:DC/DC 开关控制器 40V Synchronous Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX15046BAEE+ | 制造商:Maxim Integrated Products 功能描述:IC, SYNC STEP-DOWN CONTROLLER, QSOP-16 |
| MAX15046BAEE+T | 功能描述:DC/DC 开关控制器 40V Synchronous Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
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